A200C
Eigenschaften
FR-4 glass epoxy laminate substrate, copper ground plane, copper via(s), metal pad(s) (bond), metal pin, plastic header (and MUX)
MUX, wirebondable with headers
Beschreibung
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Sigma-Aldrich
Printed Circuit Board Chip
A100C
A300C
IDE101
Interdigitated Chip
wirebondable with headers
12 position(s) die, wirebondable with headers
BN/SiO2 coating
FR-4 glass epoxy laminate substrate, copper via(s), metal pin, copper ground plane, plastic header (and MUX), metal pad(s) (bond)
ENEPIG plating, FR-4 glass epoxy laminate substrate, copper ground plane, copper via(s), metal pin, plastic header
FR-4 glass epoxy laminate substrate, copper ground plane, copper via(s), metal pad(s) (bond), metal pin, plastic header
gold/chromium electrode (Au/Cr)
Explore all of our products under Printed Circuit Board Chip
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