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Merck
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重要文件

667447

Sigma-Aldrich

陶瓷蚀刻剂 A

同義詞:

Al2O3 Etch, GaN Etch, Si3N4 Etch, 氧化铝蚀刻剂, 氮化硅蚀刻剂, 氮化镓蚀刻剂

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About This Item

MDL號碼:
MFCD08705343
分類程式碼代碼:
12352300
NACRES:
NA.23
暫時無法取得訂價和供貨情況

應用

用于氮化硅 (Si3N4)、氮化镓 (GaN) 或氧化铝 (Al2O3) 的快速可控蚀刻。

特點和優勢

180°C 下的蚀刻速率：
氧化铝 120Å/min
氮化硅 125Å/min
氮化镓 80Å/min
二氧化硅 1Å/min
硅 1Å/min

象形圖

CorrosionExclamation mark
GHS05,GHS07

訊號詞

Danger

危險聲明

H290,H302,H314

危險分類

Acute Tox. 4 Oral - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1B

儲存類別代碼

8B - Non-combustible corrosive hazardous materials

水污染物質分類（WGK）

WGK 1

閃點（°F）

Not applicable

閃點（°C）

Not applicable

個人防護裝備

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter

從最近期的版本中選擇一個：

分析證明 (COA)

Lot/Batch Number
MKCV9361
MKCW4222
MKCT3785
MKCP2744
MKCP1720

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Questions

1–2 of 2 Questions  

  1. What is the etch selectivity of the etchant with respect to YSZ? Will it attack YSZ.

    1 answer

    1. Unfortunately, the etch selectivity to YSZ has not been determined. The bulk of this product is phosphoric acid, which has been studied as an etchant for Yttria-stabilized Zirconia. Please see the links below to publications that may be helpful.
      ACID ETCHING SURFACE TREATMENT OF FELDSPATHIC, ALUMINA AND ZIRCONIA CERAMICS: A MICROMORPHOLOGICAL SEM ANALYSIS.
      http://moderndentistrymedia.com/may_june2006/zarone2.pdf

      Effect of 37% Phosphoric Acid Etchant on Surface Topography of Zirconia Crowns – An In Vitro Study
      https://aimdrjournal.com/wp-content/uploads/2021/06/DE2_OA_Adi-edit.pdf

      Room-temperature etching of stabilized zirconia
      https://link.springer.com/content/pdf/10.1007/BF00838349.pdf

      Helpful?

  2. What is the etch selectivity of the etchant with respect to aluminum metal? Is product 667447 suitable for use as an alumina etchant?

    1 answer

    1. The Ceramic Etchant A has a much higher etching rate for aluminum compared to alumina. Additionally, without an oxidizer, it may leave smut and residue behind. Given the solubility properties of both materials, it is not feasible to selectively etch alumina without significantly faster etching of aluminum.

      Helpful?

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