推薦產品
成份
volatiles, 50-80%
品質等級
bp
100 °C (lit.)
100 °C/1 atm
溶解度
H2O: miscible
密度
1.2924 g/mL at 25 °C (lit.)
InChI
1S/HI.K/h1H;/q;+1/p-1
InChI 密鑰
NLKNQRATVPKPDG-UHFFFAOYSA-M
一般說明
蚀刻容易控制,底切最小。室温下运行。无氰标准应用。25℃时腐蚀速率为 28 埃/秒。
金蚀刻剂是由碘化钾和碘组成的络合剂,通过电化学氧化金合成。
應用
金蚀刻剂是选择性通用金蚀刻剂,可与负性和正性光致抗蚀剂相容。用于蚀刻金(Au)电极,随后用扫描电子显微镜(SEM)成像,进行形态学研究,也用于金属层,制备纳米电极阵列。 金蚀刻剂还可用于金属辅助化学蚀刻(MACE),制造基于p-n结结构硅纳米柱的太阳能电池。
訊號詞
Danger
危險聲明
危險分類
STOT RE 1 Oral
標靶器官
Thyroid
儲存類別代碼
6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects
水污染物質分類(WGK)
WGK 3
閃點(°F)
Not applicable
閃點(°C)
Not applicable
個人防護裝備
Eyeshields, Faceshields, Gloves, multi-purpose combination respirator cartridge (US)
分析證明 (COA)
輸入產品批次/批號來搜索 分析證明 (COA)。在產品’s標籤上找到批次和批號,寫有 ‘Lot’或‘Batch’.。
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Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.
光阻套件為光刻製程提供預先稱重的化學成分,並針對不同的基板選擇提供獨立的蝕刻劑。
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