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Merck

647705

Silicon

greener alternative

wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.3 mm

Synonim(y):

Silicon element

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1 EA

688,00 zł

688,00 zł


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Informacje o tej pozycji

Wzór liniowy:
Si
Numer CAS:
Masa cząsteczkowa:
28.09
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
12352300
MDL number:

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InChI

1S/Si

SMILES string

[Si]

InChI key

XUIMIQQOPSSXEZ-UHFFFAOYSA-N

form

crystalline (cubic (a = 5.4037)), wafer

contains

boron as dopant

greener alternative product characteristics

Design for Energy Efficiency
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sustainability

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diam. × thickness

2 in. × 0.3 mm

bp

2355 °C (lit.)

mp

1410 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

greener alternative category

semiconductor properties

<111>, P-type

Quality Level

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Ta pozycja
647772647764647675
form

crystalline (cubic (a = 5.4037)), wafer

form

crystalline (cubic (a = 5.4037)), wafer (single side polished)

form

crystalline (cubic (a = 5.4037)), wafer (single side polished)

form

crystalline (cubic (a = 5.4037)), wafer (single side polished)

Quality Level

100

Quality Level

100

Quality Level

100

Quality Level

100

bp

2355 °C (lit.)

bp

2355 °C (lit.)

bp

2355 °C (lit.)

bp

2355 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

mp

1410 °C (lit.)

mp

1410 °C (lit.)

mp

1410 °C (lit.)

mp

1410 °C (lit.)

contains

boron as dopant

contains

boron as dopant

contains

boron as dopant

contains

boron as dopant

General description

0 vortex defects. Etch pitch density (EPD) < 100 (cm-2). Resistivity 10-3 - 40 Ωcm
Oxygen content: <= 1~1.8 x 1018 /cm3; Carbon content: <= 5 x 1016 /cm3; Boule diameter: 1~8 ″
We are committed to bringing you Greener Alternative Products, which belongs to one of the four categories of greener alternatives. This enabling product has been enhanced for energy efficiency. Click here for more information.
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Klasa składowania

13 - Non Combustible Solids

wgk

WGK 2

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Eyeshields, Gloves, type N95 (US)


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Dokumenty związane z niedawno zakupionymi produktami zostały zamieszczone w Bibliotece dokumentów.

Odwiedź Bibliotekę dokumentów

Chengyong Li et al.
Journal of nanoscience and nanotechnology, 13(3), 2272-2275 (2013-06-13)
Mesoporous Si-C-O fibers were fabricated by air activation of a kind of carbon-rich SiC-C fibers at 600 degrees C. The SiC-C fibers were prepared from the hybrid precursor of polycarbosilane and pitch through melt-spinning, air curing and pyrolysis in nitrogen.
Bo-Soon Kim et al.
Journal of nanoscience and nanotechnology, 13(5), 3622-3626 (2013-07-19)
A subwavelength structure (SWS) was formed via a simple chemical wet etching using a gold (Au) catalyst. Single nano-sized Au particles were fabricated by metallic self-aggregation. The deposition and thermal annealing of the thin metallic film were carried out. Thermal
Pil Ju Ko et al.
Journal of nanoscience and nanotechnology, 13(4), 2451-2460 (2013-06-15)
The physical properties of porous materials are being exploited for a wide range of applications including optical biosensors, waveguides, gas sensors, micro capacitors, and solar cells. Here, we review the fast, easy and inexpensive electrochemical anodization based fabrication porous silicon
Seungil Park et al.
Journal of nanoscience and nanotechnology, 13(5), 3397-3402 (2013-07-19)
We investigated the thin film growths of hydrogenated silicon by hot-wire chemical vapor deposition with different flow rates of SiH4 and H2 mixture ambient and fabricated thin film solar cells by implementing the intrinsic layers to SiC/Si heterojunction p-i-n structures.
Hyunhui Kim et al.
Journal of nanoscience and nanotechnology, 13(5), 3559-3563 (2013-07-19)
Silicon sheets were fabricated by a new fabricating method, spin casting with various rotation speeds of the graphite mold. The microstructure of spin-cast silicon sheets were investigated using an electron probe microanalyzer (EPMA) and scanning electron microscope/electron backscatter diffraction/orientation image

Produkty

Hybrid organic-inorganic sol-gel materials containing silica were first called “ORMOSILs” in 1984.

Protokoły

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

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