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詳細
Coverage: 250-270 cm2 per g (using a 230 mesh stainless steel screen)
Flash point: 90°C
Solid content: 44-46% (at 130°C)
Volume resistivity: 925 ohm cm at 60°C
527 ohm cm at 130°C
形状
paste
硬度
5B (pencil hardness)
粘度
0.72-1.78 Pa.s (Haake RS1 C20/2° TiL at 230 sec-1 at 25°C)
詳細
The ink has undergone electrical and mechanical testing which has shown that it is very flexible.
アプリケーション
- Screen-printable silver paste material for semitransparent and flexible metal–semiconductor–metal photodetectors with liquid-phase procedure: This study presents a flexible MSM photodetector using conductive Ag paste electrodes made through a screen-printing liquid-phase process, offering insights into the semitransparency of Ag paste solutions (Tsai et al., 2022).
- Effect of polymer binder on the transparent conducting electrodes on stretchable film fabricated by screen printing of silver paste: This research examines the role of polymer binders in silver pastes used on flexible polyurethane and polyester films, focusing on rheological properties (Lim et al., 2017).
- Deposition of high conductivity low silver content materials by screen printing: Investigates novel polymer inks alongside traditional paste materials for their application in both rigid and flexible circuit printing, emphasizing cost-effectiveness and performance (Jewell et al., 2015).
- Printability of the screen-printed strain sensor with carbon black/silver paste for sensitive wearable electronics: Explores the use of carbon black/Ag nanocomposites in pastes for flexible printed electronic products, enhancing the sensitivity and flexibility of these devices (Qi et al., 2020).
- High-concentration copper nanoparticles synthesis process for screen-printing conductive paste on flexible substrate: While focusing on copper, this study provides relevant comparisons to silver pastes, detailing formulations suitable for screen-printing on flexible polyester substrates (Tam and Ng, 2015).
特徴および利点
Low silver content paste presenting low resistivity, good flexibility and good adhesion on the mentioned substrates
物性
Sheet resistivity: 15-20mΩ/square at 25μm
30-45mΩ/square at 10μm
Bending test: ink survived 3 cycles
(Substrate is creased and bent internally and externally with a 2kg weight.
The test piece has failed when the resistance reaches 10 times the initial value.)
Double curing: aging factor of -0.7%after double curing at 150°C for 15min
How water test: aging factor of -0.2% after boiling for 1hour
調製ノート
Please mix well the paste without introducing air bubbles prior to screen printing.
Screen Printing Equipment: semi-automatic, manual
Ink Screen Life: >3 hours
Screen Types: suitable for use with polyester or stainless steel meshes in the range of 156 to 325 tpi.
Typical Drying Conditions: Dry at 130°C - 150°C for 10-30 minutes or on a belt dryer with air flow that sees 130°C-170°C for 5-10 minutes.
Clean Up Solvent: ethoxy propanol or sericol
Substrate: polyimide, PET, PEN and can also be printed on more rigid substrates such as alumina
法的情報
シグナルワード
Warning
危険有害性情報
危険有害性の分類
Aquatic Acute 1 - Aquatic Chronic 1
保管分類コード
10 - Combustible liquids
WGK
WGK 3
引火点(°F)
194.0 °F
引火点(℃)
90 °C
適用法令
試験研究用途を考慮した関連法令を主に挙げております。化学物質以外については、一部の情報のみ提供しています。 製品を安全かつ合法的に使用することは、使用者の義務です。最新情報により修正される場合があります。WEBの反映には時間を要することがあるため、適宜SDSをご参照ください。
PRTR
第一種指定化学物質
消防法
第4類:引火性液体
第三石油類
危険等級III
非水溶性液体
労働安全衛生法名称等を表示すべき危険物及び有害物
名称等を表示すべき危険物及び有害物
労働安全衛生法名称等を通知すべき危険物及び有害物
名称等を通知すべき危険物及び有害物
Jan Code
901769-VAR:
901769-100G:4548173371436
901769-25G:4548173371443
901769-BULK:
試験成績書(COA)
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資料
Small molecular weight organic semiconductors are promising for flexible transistor applications in next-gen soft electronics.
Professors Tokito and Takeda share design principles and optimization protocols for organic electronic devices, focusing on flexibility and low cost.
時任教授と竹田教授が、プリントおよび溶液処理された、低コストで高度にフレキシブルな有機エレクトロニクスデバイスのための、新しい材料、デバイス構造設計の原則、および性能最適化のプロトコルを紹介します。
ライフサイエンス、有機合成、材料科学、クロマトグラフィー、分析など、あらゆる分野の研究に経験のあるメンバーがおります。.
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