Direkt zum Inhalt
Merck

901655

Sigma-Aldrich

Electroless nickel plating solution

ammonia free

Synonym(e):

Nickelex

Anmeldenzur Ansicht organisationsspezifischer und vertraglich vereinbarter Preise


About This Item

UNSPSC-Code:
12352303
NACRES:
NA.23

Form

liquid

Farbe

blue to green

pH-Wert

4.8-5.2

Suchen Sie nach ähnlichen Produkten? Aufrufen Leitfaden zum Produktvergleich

Allgemeine Beschreibung

Electroless nickel plating solution (Nickelex) is a type of auto-catalytic plating in which many reactions occur in an aqueous solution without any external power source. Its process includes the catalytic reduction of nickel in an aqueous solution. Nickelex produces an amorphous deposition of nickel in the as-plated condition. It shows properties such as good hardness, corrosion resistance and wear resistance.
Stable electroless nickel plating composition, ready to use, specified for making ohmic contacts to silicon and other semiconductor materials

Advantages
  • Stable, ready to use
  • Plates without generating ammonia fumes
  • Produces quality electrical contacts on p- and n-type silicon
  • Does not compensate for p- or n- type conductivity
  • Excellent adhesion and solderability
  • Plates on silicon, germanium, gallium arsenide, cadmium sulfide
Nickelex is a vastly improved, electroless nickel preparation, formulated specially for semiconductor use. The composition is based upon ions of a nickel complex and hypophosphite together in solution with a catalytic accelerator and a stabilizer. The solution is also buffered at the optimum pH for electroless nickel catalysis. In addition, only high purity chemical materials with trace impurities (such as copper) specifically removed are utilized. NICKELEX, is a very stable product, free of ammonia, and ready for use without the need of any addition or mixing. Fume problems are completely eliminated. Nickelex, furthermore, is not subject to undesirable changes in composition during use.
The chemical reaction during the electroless plating process involves an oxidation-reduction reaction between nickelous and hypophosphite ions. The reaction is essentially a two step process occurring simultaneously.

(1) H2PO2- + H2O --> H2OPO3- + H2
(2) Ni ++ (complex) + H2 --> Ni + 2H+

The reaction progresses catalytically with nickel deposition occurring at the operating temperature of 95 °C - 100 °C. The nascent hydrogen evolved insures an oxide free nickel deposit. In addition some NiP formed in a side reaction improves corrosion resistance and solderability. The nickel deposit is highly conductive, remains unstressed, particularly after suitable heat treatment, and shows good adherence.

Anwendung

Nickelex can be deposited on p-type porous silicon for potential usage in light-emitting diodes (LEDs), and organic solar cells.
Use of Nickelex:

  • Nickelex provides good mechanical and electrical contacts for semicodonductor devices (silicon rectifers, solar cells, varactors, microwave diodes, transistors, microcircuits, etc.). The quality of the electrical contact is excellent if the surface of silicon is abraded by lapping to increase surface recombination velocity; if the surface is highly doped from diffusion; or if the semicondcutor resistivity is low (0.1 ohm-cm). Nickelex also produces adherent deposits on germanium, gallium arsenide, and cadmium sulfide.
  • The Nickelex plate exhibits excellent solderability with lead, tin, and Pb/Sn alloys. Flux can be omitted when furnaced soldered in a hydrogen or non-oxidizing atmosphere.

Instructions

Complete metallization procedures are provided for silicon rectifier and planar device fabrication. These procedures should be followed to obtain optimum adhesion of nickel and quality of the ohmic contacts.

Signalwort

Danger

Gefahreneinstufungen

Acute Tox. 3 Dermal - Acute Tox. 3 Oral - Acute Tox. 4 Inhalation - Aquatic Acute 1 - Aquatic Chronic 1 - Carc. 1A Inhalation - Eye Irrit. 2 - Muta. 2 - Repr. 1B - Resp. Sens. 1 - Skin Irrit. 2 - Skin Sens. 1 - STOT RE 1

Zielorgane

Lungs

Lagerklassenschlüssel

6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects

WGK

WGK 3

Flammpunkt (°F)

Not applicable

Flammpunkt (°C)

Not applicable


Analysenzertifikate (COA)

Suchen Sie nach Analysenzertifikate (COA), indem Sie die Lot-/Chargennummer des Produkts eingeben. Lot- und Chargennummern sind auf dem Produktetikett hinter den Wörtern ‘Lot’ oder ‘Batch’ (Lot oder Charge) zu finden.

Besitzen Sie dieses Produkt bereits?

In der Dokumentenbibliothek finden Sie die Dokumentation zu den Produkten, die Sie kürzlich erworben haben.

Die Dokumentenbibliothek aufrufen

Electroless nickel plating on silicon carbide nanoparticles
Chen Y, et al.
Surface and Coatings Technology, 172(1), 90-94 (2003)
Electroless nickel plating-a review
Loto CA
Silicon, 8(2), 177-186 (2016)
Electroless deposition and silicidation of Ni contacts into p-type Porous Silicon
Andersson HA, et al.
Journal of Porous Materials, 15(3), 335-341 (2008)
Flexible, transparent contacts for inorganic nanostructures and thin films
Turner-Evans DB, et al.
Advanced Materials, 25(29), 4018-4022 (2013)

Unser Team von Wissenschaftlern verfügt über Erfahrung in allen Forschungsbereichen einschließlich Life Science, Materialwissenschaften, chemischer Synthese, Chromatographie, Analytik und vielen mehr..

Setzen Sie sich mit dem technischen Dienst in Verbindung.