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形状
liquid
色
blue
pH
>9
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詳細
Improved standard electroless nickel plating composition specific for making ohmic contacts to silicon and other semiconductor materials.
Advantages:
An improved electroless nickel plating solution (Brenner type) formulated for semiconductor use. Specifically, it is designed to deposit nickel uniformly and at equal plating rates on both p- and n- type silicon. The composition of this product is based upon ions of nickel complexes and hypophosphite with stabilizers. Only high purity chemicals are used. The plating solution is a stable product ready to use without the need for additions or mixing. Transene Electroless Nickel Plating Ammonia Type operates under conditions of a catalytic oxidation-reduction reaction between nickelous and hypophosphite ions. The chemical reaction is essentially a two-step process occurring simultaneously.
H2PO2- + H2O --> H2PO3 - + 2H+ + 2e- (1)
Ni2+ + 2e- --> Ni (2)
Nickel is deposited containing about 1% phosphide which improves the physical properties of the metalization.
The plating solution has an optimized standard electrode potential of 0.44 volts. The electrode characteristics help to regulate the difference in electronegativity between p- and n- type silicon relative to the potential of the nickel complex ions. Thus the rate of deposition of nickel on p- and n- silicon is equalized. The deposition on p- and n- type silicon is 2,000 Å/minute at 90 °C.
Advantages:
- Stable, ready to use
- Plates uniformly on p- and n- type silicon
- Offers excellent adhesion and solderability
- Plates on silicon, germanium, gallium arsenide
- Produces quality electrical contacts on p- and n- type silicon
An improved electroless nickel plating solution (Brenner type) formulated for semiconductor use. Specifically, it is designed to deposit nickel uniformly and at equal plating rates on both p- and n- type silicon. The composition of this product is based upon ions of nickel complexes and hypophosphite with stabilizers. Only high purity chemicals are used. The plating solution is a stable product ready to use without the need for additions or mixing. Transene Electroless Nickel Plating Ammonia Type operates under conditions of a catalytic oxidation-reduction reaction between nickelous and hypophosphite ions. The chemical reaction is essentially a two-step process occurring simultaneously.
H2PO2- + H2O --> H2PO3 - + 2H+ + 2e- (1)
Ni2+ + 2e- --> Ni (2)
Nickel is deposited containing about 1% phosphide which improves the physical properties of the metalization.
The plating solution has an optimized standard electrode potential of 0.44 volts. The electrode characteristics help to regulate the difference in electronegativity between p- and n- type silicon relative to the potential of the nickel complex ions. Thus the rate of deposition of nickel on p- and n- silicon is equalized. The deposition on p- and n- type silicon is 2,000 Å/minute at 90 °C.
アプリケーション
Silicon surfaces must be clean and etched in Buffer-HF or HF solution to remove oxide, rinsed and stored in alcohol. On polished silicon wafers, plate 1000-2000 A of electroless nickel; greater thickness on lapped silicon surfaces. The deposited nickel can be sintered into silicon at 500 °C to 750 °C to promote adhesion and ohmic contact. A second nickel deposit is generally required.
シグナルワード
Danger
危険有害性の分類
Aquatic Chronic 2 - Carc. 1A Inhalation - Eye Irrit. 2 - Muta. 2 - Repr. 1B - Resp. Sens. 1 - Skin Irrit. 2 - Skin Sens. 1 - STOT RE 1 - STOT RE 2 Inhalation
ターゲットの組織
Lungs
WGK
WGK 3
適用法令
試験研究用途を考慮した関連法令を主に挙げております。化学物質以外については、一部の情報のみ提供しています。 製品を安全かつ合法的に使用することは、使用者の義務です。最新情報により修正される場合があります。WEBの反映には時間を要することがあるため、適宜SDSをご参照ください。
PRTR
第一種指定化学物質
特定第一種指定化学物質
労働安全衛生法名称等を表示すべき危険物及び有害物
名称等を表示すべき危険物及び有害物
労働安全衛生法名称等を通知すべき危険物及び有害物
名称等を通知すべき危険物及び有害物
Jan Code
901647-BULK:
901647-VAR:
901647-1L:
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