Four new bis(tpy) unimers with different linkers between the thieno[3,2-b]thiophene-2,5-diyl central unit and terpyridine-4'-yl (tpy) end-groups: no linker (Tt), ethynediyl (TtE), 1,4-phenylene (TtPh) and 2,2'-bithophene-5,5'-diyl (TtB) are prepared, characterized, and assembled with Fe2+ ions to metallo-supramolecular polymers (Fe-MSPs). The Fe-MSP
A fused thieno (3, 2-b) thiophene-dithiophene based donor molecule for organic photovoltaics: a structural comparative study with indacenodithiophene
Abe Y, et al.
Journal of Material Chemistry C, 4(41), 9656-9663 (2016)
A solution-processed high performance organic solar cell using a small molecule with the thieno (3, 2-b) thiophene central unit
Zhang, Q, et al.
Chemical Communications (Cambridge, England), 51(83), 15268-15271 (2015)
Multilevel metal interconnects are crucial for the development of large-scale organic integrated circuits. In particular, three-dimensional integrated circuits require a large number of vertical interconnects between layers. Here, we present a novel multilevel metal interconnect scheme that involves solvent-free patterning