- Self-Assembled On-Chip-Integrated Giant Magneto-Impedance Sensorics.
Self-Assembled On-Chip-Integrated Giant Magneto-Impedance Sensorics.
Advanced materials (Deerfield Beach, Fla.) (2015-09-24)
Daniil Karnaushenko, Dmitriy D Karnaushenko, Denys Makarov, Stefan Baunack, Rudolf Schäfer, Oliver G Schmidt
PMID26398863
摘要
A novel method relying on strain engineering to realize arrays of on-chip-integrated giant magneto-impedance (GMI) sensors equipped with pick-up coils is put forth. The geometrical transformation of an initially planar layout into a tubular 3D architecture stabilizes favorable azimuthal magnetic domain patterns. This work creates a solid foundation for further development of CMOS compatible GMI sensorics for magnetoencephalography.
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