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化驗
98%
形狀
powder
反應適用性
core: silver
reagent type: catalyst
mp
257-260 °C (dec.) (lit.)
SMILES 字串
FC(F)(F)C(=O)O[Ag]
InChI
1S/C2HF3O2.Ag/c3-2(4,5)1(6)7;/h(H,6,7);/q;+1/p-1
InChI 密鑰
KZJPVUDYAMEDRM-UHFFFAOYSA-M
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應用
訊號詞
Danger
危險聲明
危險分類
Acute Tox. 2 Oral - Aquatic Acute 1 - Aquatic Chronic 1
儲存類別代碼
6.1A - Combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
水污染物質分類(WGK)
WGK 3
閃點(°F)
Not applicable
閃點(°C)
Not applicable
個人防護裝備
dust mask type N95 (US), Eyeshields, Gloves
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商品
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
We are proud to offer a treasure-trove of gold precatalysts and silver salts, as well as an extensive portfolio of unsaturated building blocks to accelerate your research success in this exciting field.
The properties of many devices are limited by the intrinsic properties of the materials that compose them.
我们的科学家团队拥有各种研究领域经验,包括生命科学、材料科学、化学合成、色谱、分析及许多其他领域.
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