901623

Buffered oxide etchant (BOE) 6:1 with surfactant

• Synonym(e): BHF, Buffered HF
• UNSPSC-Code: 12161700
• NACRES: NA.23

Eigenschaften

• Form: liquid

Beschreibung

Allgemeine Beschreibung

Buffered oxide etchant (BOE) is a wet etchant used in microfabrication. Its primary use is in etching thin films of silicon dioxide (SiO₂) or silicon nitride (Si₃N₄). It is a mixture of a buffering agent, such as ammonium fluoride (NH₄F), and hydrofluoric acid (HF). Concentrated HF etches silicon dioxide too quickly for good process control and also peels photoresist used in lithographic patterning.

Anwendung

Buffered oxide etchant (BOE) 6:1 with surfactant may be used in the oxide removal of AlGaN/GaN-based high electron mobility transistors for gate photolithography.[1][2] It may also be used in a buffer oxide etchant method for the fabrication of micro biochip.[3]

Sicherheitshinweise

• Piktogramme: GHS06,GHS05
• Signalwort: Danger
• H-Sätze: H300 + H310 + H330,H314
• P-Sätze: P260 - P270 - P280 - P303 + P361 + P353 - P304 + P340 + P310 - P305 + P351 + P338
• Gefahreneinstufungen: Acute Tox. 1 Dermal - Acute Tox. 2 Inhalation - Acute Tox. 2 Oral - Eye Dam. 1 - Skin Corr. 1A
• Lagerklassenschlüssel: 6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
• WGK: WGK 2
• Flammpunkt (°F): Not applicable
• Flammpunkt (°C): Not applicable