推薦產品
品質等級
化驗
97%
形狀
powder and chunks
反應適用性
core: copper
reagent type: catalyst
mp
250 °C (dec.) (lit.)
SMILES 字串
CC(=O)O[Cu]
InChI
1S/C2H4O2.Cu/c1-2(3)4;/h1H3,(H,3,4);/q;+1/p-1
InChI 密鑰
RFKZUAOAYVHBOY-UHFFFAOYSA-M
應用
乙酸铜（CuOAc）曾用作制备铜纳米粒子和CuAlO2 p型纳米结构半导体的起始物料。
儲存類別代碼
11 - Combustible Solids
水污染物質分類（WGK）
WGK 3
閃點（°F）
Not applicable
閃點（°C）
Not applicable
個人防護裝備
dust mask type N95 (US), Eyeshields, Gloves
從最近期的版本中選擇一個：
分析證明 (COA)
Lot/Batch Number
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文章
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
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