901623

Buffered oxide etchant (BOE) 6:1 with surfactant

• Sinónimos: BHF, Buffered HF
• UNSPSC Code: 12161700
• NACRES: NA.23

Propiedades

• form: liquid

Descripción

General description

Buffered oxide etchant (BOE) is a wet etchant used in microfabrication. Its primary use is in etching thin films of silicon dioxide (SiO₂) or silicon nitride (Si₃N₄). It is a mixture of a buffering agent, such as ammonium fluoride (NH₄F), and hydrofluoric acid (HF). Concentrated HF etches silicon dioxide too quickly for good process control and also peels photoresist used in lithographic patterning.

Application

Buffered oxide etchant (BOE) 6:1 with surfactant may be used in the oxide removal of AlGaN/GaN-based high electron mobility transistors for gate photolithography.[1][2] It may also be used in a buffer oxide etchant method for the fabrication of micro biochip.[3]

Información de seguridad

• pictograms: GHS06,GHS05
• signalword: Danger
• hcodes: H300 + H310 + H330,H314
• pcodes: P260 - P270 - P280 - P303 + P361 + P353 - P304 + P340 + P310 - P305 + P351 + P338
• Hazard Classifications: Acute Tox. 1 Dermal - Acute Tox. 2 Inhalation - Acute Tox. 2 Oral - Eye Dam. 1 - Skin Corr. 1A
• Storage Class: 6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
• wgk_germany: WGK 2
• flash_point_f: Not applicable
• flash_point_c: Not applicable