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重要文件

763721

Sigma-Aldrich

4-(1,3-二甲基-2,3-二氢-1H-苯并咪唑-2-基)-N,N-二苯基苯胺

98%

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About This Item

經驗公式(希爾表示法):
C27H25N3
分子量::
391.51
MDL號碼:
分類程式碼代碼:
12352103
PubChem物質ID:
NACRES:
NA.23
暫時無法取得訂價和供貨情況

化驗

98%

形狀

powder or crystals

mp

145-150 °C

λmax

308 nm in dichloromethane

SMILES 字串

CN1C(N(C)c2ccccc12)c3ccc(cc3)N(c4ccccc4)c5ccccc5

InChI

1S/C27H25N3/c1-28-25-15-9-10-16-26(25)29(2)27(28)21-17-19-24(20-18-21)30(22-11-5-3-6-12-22)23-13-7-4-8-14-23/h3-20,27H,1-2H3

InChI 密鑰

YUDZJTFIRBVGFN-UHFFFAOYSA-N

應用

  • 用作 C60 富勒烯的 n 型掺杂剂,C60 富勒烯是有机和印刷电子产品中的 n 型半导体。[1]
  • 在溶液处理的 n 通道有机薄膜晶体管(OTFT)中用作空气稳定的 n 型掺杂剂。[2]

特點和優勢

  • 在环境条件下高度稳定。
  • 在 TFT 中形成透明、均匀的薄膜。 [3]

象形圖

Exclamation mark

訊號詞

Warning

危險聲明

防範說明

危險分類

Acute Tox. 4 Oral

儲存類別代碼

11 - Combustible Solids

水污染物質分類(WGK)

WGK 3

閃點(°F)

Not applicable

閃點(°C)

Not applicable


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N-type doping of poly (p-phenylene vinylene) with air-stable dopants
Lu, M., Nicolai, H. T., Wetzelaer, G. J. A., & Blom, P. W.
Applied Physics Letters, 99(17), 173302-173302 (2011)
A comparison of two air-stable molecular-dopants for C60
Menke, T., Wei, P., Ray, D., Kleemann, H., Naab, B. D., Bao, Z., & Riede, M.
Organic Electronics, 13(12), 3319-3325 (2012)
Molecular n-type doping for air-stable electron transport in vacuum-processed n-channel organic transistors
Oh, Joon Hak, Peng Wei, and Zhenan Bao
Applied Physics Letters, 97(24), 243305-243305 (2010)
Peng Wei et al.
Journal of the American Chemical Society, 132(26), 8852-8853 (2010-06-18)
We present here the development of a new solution-processable n-type dopant, N-DMBI. Our experimental results demonstrated that a well-known n-channel semiconductor, [6,6]-phenyl C(61) butyric acid methyl ester (PCBM), can be effectively doped with N-DMBI by solution processing; the film conductivity

文章

Fabrication procedure of organic field effect transistor device using a soluble pentacene precursor.

Solution-processed organic photovoltaic devices (OPVs) have emerged as a promising clean energy generating technology due to their ease of fabrication, potential to enable low-cost manufacturing via printing or coating techniques, and ability to be incorporated onto light weight, flexible substrates.

Thin, lightweight, and flexible electronic devices meet widespread demand for scalable, portable, and robust technology.

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