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Merck

257222

Sigma-Aldrich

三甲基铝

97%

别名:

TMA, 三甲基铝

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About This Item

线性分子式:
(CH3)3Al
CAS号:
分子量:
72.09
Beilstein:
3587197
EC號碼:
MDL號碼:
分類程式碼代碼:
12352103
PubChem物質ID:
NACRES:
NA.23

蒸汽壓力

69.3 mmHg ( 60 °C)

品質等級

描述

heat of vaporization: ~41.9 kJ/mol (dimer)

化驗

97%

形狀

liquid

反應適用性

core: aluminum

bp

125-126 °C (lit.)
127 °C/760 mmHg
20 °C/8 mmHg
56 °C/50 mmHg

mp

15 °C (lit.)

密度

0.752 g/mL at 25 °C (lit.)

SMILES 字串

C[Al](C)C

InChI

1S/3CH3.Al/h3*1H3;

InChI 密鑰

JLTRXTDYQLMHGR-UHFFFAOYSA-N

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一般說明

三甲基铝(TMA)是在化学气相沉积(CVD)工艺中广泛应用的前体,用于生产各种应用中的薄膜。TMA具有高反应活性和自燃性,这些性质使其成为薄膜沉积过程中的有效铝源,可改善光电性质,如增强的光吸收和载流子传输特性。

應用

三甲基铝可用于:
  • 作为生长引发剂,通过原子层沉积合成自组装铝纳米颗粒。
  • 作为合成铝掺杂ZnO膜(AZO)的前体,用于钙钛矿太阳能电池的电子传输层。TMA增强钙钛矿层的电导率和热稳定性
  • 制备用于锂离子电池的Al2O3涂层硅合金阳极。这种涂层有助于抑制硅的体积膨胀,提高电池的稳定性。
  • 制备具有优异抗自放电性能(260小时)和长稳定性(900次循环)的Al2O3涂层石墨电极,用于铝离子电池。

包裝

以配备1/4转向青铜球阀(Z122661)的Sure/Pac气瓶供货。配备1/4"" NPT出口内螺纹,并以1/4"" NPT外螺纹碳钢塞密封。确认阀门处于关闭位置后必须在使用前取下塞子。

适配:详情参见技术手册AL-136:Aldrich Sure/Pac 气缸系统

其他說明

低于20°C条件下储存可能会导致结晶的形成。

法律資訊

Aldrich is a registered trademark of Sigma-Aldrich Co. LLC
Sure/Pac is a trademark of Sigma-Aldrich Co. LLC

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产品编号
说明
价格

隔膜進氣口介面卡

产品编号
说明
价格

象形圖

FlameCorrosion

訊號詞

Danger

危險聲明

危險分類

Eye Dam. 1 - Pyr. Liq. 1 - Skin Corr. 1B - Water-react 1

安全危害

儲存類別代碼

4.2 - Pyrophoric and self-heating hazardous materials

水污染物質分類(WGK)

nwg

閃點(°F)

No data available

閃點(°C)

No data available

個人防護裝備

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter


历史批次信息供参考:

分析证书(COA)

Lot/Batch Number

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访问文档库

Aluminum oxide from trimethylaluminum and water by atomic layer deposition: The temperature dependence of residual stress, elastic modulus, hardness and adhesion
Oili ME, et al.
Thin Solid Films, 552, 124-135 (2014)
Metalorganic chemical vapor deposition of Al2O3 using trimethylaluminum and O2 precursors: Growth mechanism and crystallinity
Liu X, et al.
Journal of Crystal Growth, 408, 78-84 (2014)
Photo-induced current and its degradation in Al4C3/Al2O3 (0001) grown by metalorganic chemical vapor deposition
Kim D, et al.
Thin Solid Films, 557, 216-221 (2014)
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