추천 제품
vapor density
1.3 (vs air)
애플리케이션
CE-200 solution can be used to etch out the copper residue or foil from the chemical vapor deposited (CVD) graphene or carbonated films by immersing the substrate with the nanomaterial into the etchant solution for 30 min.
It is ideal for spray etching of copper. Ferric chloride based Cu etchant with etch rate of 0.5 mil/min @ 40 °C.
신호어
Danger
유해 및 위험 성명서
Hazard Classifications
Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1
Storage Class Code
8B - Non-combustible corrosive hazardous materials
WGK
WGK 1
Flash Point (°F)
Not applicable
Flash Point (°C)
Not applicable
개인 보호 장비
Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter
시험 성적서(COA)
제품의 로트/배치 번호를 입력하여 시험 성적서(COA)을 검색하십시오. 로트 및 배치 번호는 제품 라벨에 있는 ‘로트’ 또는 ‘배치’라는 용어 뒤에서 찾을 수 있습니다.
이미 열람한 고객
The effect of copper pre-cleaning on graphene synthesis
Kim SM, et al.
Nanotechnology, 24(36), 365602-365602 (2013)
Copper etching with cupric chloride and regeneration of waste etchant
Cakir O
Journal of Materials Processing Technology, 175(1-3), 63-68 (2006)
Stretchable and Hydrophobic Electrochromic Devices Using Wrinkled Graphene and PEDOT: PSS
Nemani SK, et al.
Journal of Nanomaterials, 2018(1-3), 63-68 (2018)
Fangyuan Zheng et al.
ACS nano, 14(2), 2137-2144 (2020-01-18)
The emergent two-dimensional (2D) materials are atomically thin and ultraflexible, promising for a variety of miniaturized, high-performance, and flexible devices in applications. On one hand, the ultrahigh flexibility causes problems: the prevalent wrinkles in 2D materials may undermine the ideal
Microbial colonisation of transparent glass-like carbon films triggered by a reversible radiation-induced hydrophobic to hydrophilic transition
Jalvo B, et al.
Royal Society of Chemistry Advances, 6(55), 50278-50287 (2016)
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