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Merck

D213705

Sigma-Aldrich

二苯基硅烷二醇

95%

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About This Item

线性分子式:
(C6H5)2Si(OH)2
CAS号:
分子量:
216.31
Beilstein:
2523445
EC號碼:
MDL號碼:
分類程式碼代碼:
12352103
PubChem物質ID:
NACRES:
NA.23

蒸汽密度

>1 (vs air)

化驗

95%

形狀

powder

SMILES 字串

O[Si](O)(c1ccccc1)c2ccccc2

InChI

1S/C12H12O2Si/c13-15(14,11-7-3-1-4-8-11)12-9-5-2-6-10-12/h1-10,13-14H

InChI 密鑰

OLLFKUHHDPMQFR-UHFFFAOYSA-N

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一般說明

二苯基硅烷二醇(DPSD)是一种烷氧基硅烷,在有机硅氧烷基树脂的合成中可用作硅烷基前体。

應用

DPSD可作为前体用于线性乙烯基低聚硅氧烷树脂合成,其可潜在用于制造耐热发光二极管(LED)密封剂。巯基丙基-苯基-低聚硅氧烷和苯基-乙烯基-低聚硅氧烷可通过使用DPSD进行合成,而DPSD能够进一步作为硫代烯衍生的介电层用于有机薄膜晶体管。

象形圖

Flame

訊號詞

Danger

危險聲明

防範說明

危險分類

Flam. Sol. 1

儲存類別代碼

4.1B - Flammable solid hazardous materials

水污染物質分類(WGK)

WGK 1

閃點(°F)

127.4 °F - closed cup

閃點(°C)

53 °C - closed cup

個人防護裝備

Eyeshields, Gloves, type P3 (EN 143) respirator cartridges


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Mechanism and nanosize products of the sol-gel reaction using diphenylsilanediol and 3-methacryloxypropyltrimethoxysilane as precursors.
Kim SY, et al.
The Journal of Physical Chemistry, 109(19), 9397-9403 (2005)
J G Cunningham et al.
American journal of veterinary research, 42(12), 2178-2181 (1981-12-01)
A controlled clinical trial of the anti-epileptic efficacy and toxic side effects of diphenylsilanediol was conducted on 24 client-owned epileptic dogs. Data obtained from an abbreviated procedural treatment program indicated that diphenylsilanediol compared favorably with primidone as an anti-epileptic compound
The Reactions of Triphenylsilanol and Diphenylsilanediol with Some Titanium Esters.
Zeitler VA, et al.
Journal of the American Chemical Society, 79(1), 4618-4621 (1957)
Sol-gel synthesized linear oligosiloxane-based hybrid material for a thermally-resistant light emitting diode (LED) encapsulant.
Bae J, et al.
Royal Society of Chemistry Advances, 3(23), 8871-8877 (2013)
Hyeon-Gyun Im et al.
ACS applied materials & interfaces, 12(50), 56462-56469 (2020-12-02)
Metal nanowires (NWs) are promising transparent conducting electrode (TCE) materials because of their excellent optoelectrical performance, intrinsic mechanical flexibility, and large-scale processability. However, the surface roughness, thermal/chemical instability, and limited electrical conductivity associated with empty spaces between metal NWs are

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