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Merck

403342

Sigma-Aldrich

Copper(I) acetate

97%

Sinónimos:

Copper monoacetate, Cuprous acetate

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About This Item

Fórmula lineal:
CuCO2CH3
Número de CAS:
Peso molecular:
122.59
EC Number:
MDL number:
UNSPSC Code:
12352103
PubChem Substance ID:
NACRES:
NA.23

assay

97%

form

powder and chunks

reaction suitability

core: copper
reagent type: catalyst

mp

250 °C (dec.) (lit.)

SMILES string

CC(=O)O[Cu]

InChI

1S/C2H4O2.Cu/c1-2(3)4;/h1H3,(H,3,4);/q;+1/p-1

InChI key

RFKZUAOAYVHBOY-UHFFFAOYSA-M

Application

Copper acetate(CuOAc) was used as a starting material for the preparation of copper nanoparticles and CuAlO2 p-type nanostructured semiconductors.

Storage Class

11 - Combustible Solids

wgk_germany

WGK 3

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

dust mask type N95 (US), Eyeshields, Gloves


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Jan Lorkowski et al.
Chemistry (Weinheim an der Bergstrasse, Germany), 25(48), 11365-11374 (2019-07-06)
Cyclic (amino)(aryl)carbenes (cAArCs) based on the isoindoline core were successfully generated in situ by α-elimination of 3-alkoxyisoindolines at high temperatures or by deprotonation of isoindol-2-ium chlorides with sodium or copper(I) acetates at low temperatures. 3-Alkoxy-isoindolines 2 a,b-OR (R=Me, Et, iPr) have
Room?Temperature Formation of Hollow Cu2O Nanoparticles.
Hung LI, et al.
Advanced Materials, 22.17, 1910-1914 (2010)
Synthesis of delafossite CuAlO 2 p-type semiconductor with a nanoparticle-based Cu (I) acetate-loaded boehmite precursor
Thu TV, et al.
Mat. Res. Bul., 46.11, 1819-1827 (2011)
Thomas G Meikle et al.
ACS applied materials & interfaces, 12(6), 6944-6954 (2020-01-10)
Herein, we demonstrate a method for the functionalization of cubic phase lipid nanoparticles (cubosomes) with a series of magnetite (Fe3O4), copper oxide (Cu2O), and silver (Ag) nanocrystals, with prospective applications across a wide range of fields, including antimicrobial treatments. The
Jingya Qin et al.
Biomacromolecules, 20(4), 1514-1521 (2019-02-23)
The self-assembly of nanostructures from elastin-like (poly)peptide (ELP) containing block copolymers has been a subject of intense investigation over decades. However, short synthetic ELPs have rarely been used due to their high inverse transition temperature; the use of short ELPs

Artículos

Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.

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