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767484

Sigma-Aldrich

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

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About This Item

Fórmula empírica (Notação de Hill):
Ni
Número CAS:
7440-02-0
Peso molecular:
58.69
Número CE:
231-111-4
Número MDL:
MFCD00011137
Código UNSPSC:
12352103
ID de substância PubChem:
329767317
NACRES:
NA.23

Ensaio

99.95% trace metals basis

forma

solid

adequação da reação

core: nickel

resistividade

6.97 μΩ-cm, 20°C

diâmetro × espessura

2.00 in. × 0.25 in.

pb

2732 °C (lit.)

pf

1453 °C (lit.)

densidade

8.9 g/mL at 25 °C (lit.)

cadeia de caracteres SMILES

[Ni]

InChI

1S/Ni

chave InChI

PXHVJJICTQNCMI-UHFFFAOYSA-N

Categorias relacionadas

Aplicação

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

Pictogramas

Health hazardExclamation mark
GHS08,GHS07

Palavra indicadora

Danger

Frases de perigo

H317,H351,H372

Classificações de perigo

Carc. 2 - Skin Sens. 1 - STOT RE 1

Código de classe de armazenamento

6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

Classe de risco de água (WGK)

WGK 2

Ponto de fulgor (°F)

Not applicable

Ponto de fulgor (°C)

Not applicable

Certificados de análise (COA)

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Sigma-Aldrich

268259

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Orally applied metal alloys can cause undesirable physical effects. A distinction needs to be made in this respect between local and systemic reactions and toxic and immunological reactions. A case is presented which illustrates this problem. In this case, the
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