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Tantalum nitride etchant

Synonym(s):

Tantalum nitride etch

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About This Item

MDL number:
MFCD08705363
UNSPSC Code:
12161700
NACRES:
NA.23

General description

Tantalum nitride etchant is a high purity etchant systems for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications.

Application

Etchant solution for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications

Features and Benefits

Etch rate 70-80 Å / sec @ 25 C. Use with gold positive or negative photoresist. Rinse with Deionized water.

Preparation Note

  • Etch times vary depending on material type (Ta, TaN, or Ta2O5) and purity.
  • Dilute with water or lower the temperature to achieve a lower etch rate. Adding 1 part water to 2 parts etchant or reducing the temperature 10 °C will approximately reduce the etch rate by 50%.
  • Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation.
  • Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.
  • Gold would be the ideal etch stop. You might also succeed with tungsten
  • Rinse with Deionized water.

pictograms

Skull and crossbonesCorrosion
GHS06,GHS05

signalword

Danger

Hazard Classifications

Acute Tox. 1 Dermal - Acute Tox. 2 Oral - Acute Tox. 3 Inhalation - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A

supp_hazards

EUH071

Storage Class

6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials

wgk_germany

WGK 2

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter

Certificates of Analysis (COA)

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