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164410

Sigma-Aldrich

Benzocyclobutene

97%

Synonym(s):

Bicyclo[4.2.0]octa-1,3,5-triene

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500 MG
$281.00

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500 MG
$281.00

About This Item

Empirical Formula (Hill Notation):
C8H8
CAS Number:
694-87-1
Molecular Weight:
104.15
MDL number:
MFCD01321219
UNSPSC Code:
12352100
PubChem Substance ID:
24850072
NACRES:
NA.22
form:
liquid
assay:
97%

$281.00

In StockDetails

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Quality Level

100

assay

97%

form

liquid

refractive index

n20/D 1.541 (lit.)

bp

150 °C/748 mmHg (lit.)

density

0.957 g/mL at 25 °C (lit.)

SMILES string

C1Cc2ccccc12

InChI

1S/C8H8/c1-2-4-8-6-5-7(8)3-1/h1-4H,5-6H2

InChI key

UMIVXZPTRXBADB-UHFFFAOYSA-N

Application

Benzocyclobutene was used as the adhesive bonding material in adhesive wafer-level bonding technique[1]. Photosensitive benzocyclobutene has been widely used as dielectric material in multilayer packaging applications[2]. It was used in fabrication of high density multilayer interconnect structures using gold metallization and polymer interlayer dielectric[3].

pictograms

Flame
GHS02

signalword

Warning

hcodes

H226

Hazard Classifications

Flam. Liq. 3

Storage Class

3 - Flammable liquids

wgk_germany

WGK 3

flash_point_f

96.8 °F - closed cup

flash_point_c

36 °C - closed cup

ppe

Eyeshields, Faceshields, Gloves, type ABEK (EN14387) respirator filter

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Certificates of Analysis (COA)

Lot/Batch Number
MKCW5239
MKCS1608
MKCQ5398
MKCQ0059
MKCM7749

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Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities.
Oberhammer J, et al.
Sens. Actuators, 105(3), 297-304 (2003)
Processing and microwave characterization of multilevel interconnects using benzocyclobutene dielectric.
Chinoy PB and Tajadod J.
IEEE Transactions on Components, Hybrids, and Manufacturing, 16(7), 714-719 (1993)
Photosensitive benzocyclobutene for stress-buffer and passivation applications (one mask manufacturing process).
Strandjord AJG, et al.
Electronic Components and Technology Conference, 1997. Proceedings., 47th. IEEE, 47 (1997)

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