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251178

Sigma-Aldrich

1,6-二碘己烷

97%, contains copper as stabilizer

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About This Item

線性公式:
I(CH2)6I
CAS號碼:
分子量::
337.97
EC號碼:
MDL號碼:
分類程式碼代碼:
12352100
PubChem物質ID:
NACRES:
NA.22

化驗

97%

形狀

liquid

包含

copper as stabilizer

折射率

n20/D 1.5852 (lit.)

bp

141-142 °C/10 mmHg (lit.)

mp

9-10 °C (lit.)

密度

2.05 g/mL at 25 °C (lit.)

SMILES 字串

ICCCCCCI

InChI

1S/C6H12I2/c7-5-3-1-2-4-6-8/h1-6H2

InChI 密鑰

QLIMAARBRDAYGQ-UHFFFAOYSA-N

應用

1,6-Diiodohexane has been used:
  • in preparation of cationic tissue plasminogen activator (t-PA)-containing polyurethane surfaces
  • as solvent additive, to improve the power conversion effciency of polymer/fullerene bulk heterojunction solar cells
  • synthesis of new macrocycles, having 2,4-dihydroxybenzophenone as a connecting unit
  • preparation of a novel ionic electrolyte, 3-(iodohexyl)-1-(3-(triethoxysilyl)propylcarbamoyl)-1H-benzo[d]imidazol-3-ium iodide

象形圖

Exclamation mark

訊號詞

Warning

危險聲明

危險分類

Eye Irrit. 2 - Skin Irrit. 2 - STOT SE 3

標靶器官

Respiratory system

儲存類別代碼

10 - Combustible liquids

水污染物質分類(WGK)

WGK 3

閃點(°F)

235.4 °F - closed cup

閃點(°C)

113 °C - closed cup

個人防護裝備

Eyeshields, Gloves, type ABEK (EN14387) respirator filter


分析證明 (COA)

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Novel silane-substituted benzimidazolium iodide as gel electrolyte for dye-sensitized solar cells.
Lee JP, et al.
Electrochimica Acta, 54(18), 4635-4670 (2009)
Zhaoqiang Wu et al.
Acta biomaterialia, 7(5), 1993-1998 (2011-01-25)
With the aim of minimizing thrombus formation in blood-contacting devices, tissue plasminogen activator (t-PA)-containing polyurethane (PU) materials have been developed. Cationic PU surfaces were prepared by grafting poly(dimethylaminoethyl methacrylate) and quaternizing the tertiary amino groups with iodomethane or 1,6-diiodohexane or
Synthesis and structure of new cyclophanes containing benzofuran and benzene rings.
Park KK, et al.
Tetrahedron Letters, 41(9), 1393-1396 (2000)
Improving device efficiency of polymer/fullerene bulk heterojunction solar cells through enhanced crystallinity and reduced grain boundaries induced by solvent additives.
Ming-Shin Su et al.
Advanced materials (Deerfield Beach, Fla.), 23(29), 3315-3319 (2011-06-15)

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