Unfortunately, the chemical composition of this product is considered proprietary. However, any hazardous ingredients are listed in the product Safety Data Sheet (SDS), section 3.
Please refer to this document to review available information.
推荐产品
形狀
liquid
顏色
colorless
pH值
7-9
一般說明
Bright electroless gold plating solution is formulated as a trouble-free gold plating solution designed to plate gold on metal parts by an electroless immersion process for printed circuit boards, transistor headers, electrical connectors, diode leads, lamps and other electronic parts. This process operates by the electroless displacement of base metals by gold, brought about by a difference in EMF potentials. Bright Electroless Gold is ready to use without modifications and will deposit gold on most common metals and alloys including copper, commercial brass, kovar, nickel, tin-lead solders, pure tin, iron and indium antimonide.
應用
- Metal parts to be plated should be thoroughly cleaned before use. The normal cleaning procedures for electroplating are adequate.
- Bright electroless gold plating solution will show a decrease in pH with use. The pH should not be allowed to deviate from the normal conditions for plating since inferior deposits result. Adjustment of pH can be conveniently accomplished by the addition of small amounts of ammonium hydroxide to raise pH or citric acid to lower it.
- The recommended plating temperature is 90 °C maximum for most metals. However, for tin-lead solders and pure tin, an optimum temperature of 50 °C is recommended.
Bright electroless gold plating solution can be used in the fabrication of electrical contacts in electronic devices. It can be used in the activation of aluminum alloy for complementary metal-oxide-semiconductor (CMOS) sensors. It can be electroplated on a polymeric substrate to fabricate ultra-light metallic micro-lattice materials.[1][2][3]
Gold content: 1/3 troy ounce per gallon.
特點和優勢
Features:
- Economical gold plating
- Plates bright gold on copper, kovar, brass, nickel, tin-lead solders and indium antimonide
- Excellent solution stability
- Operates with simple control of plating solution
- Ready-to-use - no mixing required
訊號詞
Danger
危險分類
Acute Tox. 3 Dermal - Acute Tox. 4 Inhalation - Acute Tox. 4 Oral - Aquatic Acute 1 - Aquatic Chronic 2 - Eye Dam. 1 - Skin Corr. 1B - STOT SE 3
標靶器官
Respiratory system
儲存類別代碼
6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
水污染物質分類（WGK）
WGK 2
閃點（°F）
Not applicable
閃點（°C）
Not applicable
其他客户在看
A simple, highly efficient route to electroless gold plating on complex 3D printed polyacrylate plastics
Kim SH, et al.
Chemical Communications (Cambridge, England), 54(74), 10463-10466 (2018)
Electroless gold plating on aluminum patterned chips for CMOS-based sensor applications
Ko JW, et al.
Journal of the Electrochemical Society, 157(1), D46-D46 (2009)
Development of new electrolytic and electroless gold plating processes for electronics applications
Osaka T, et al.
Science and Technology of Advanced Materials, 7(5), 425-437 (2006)
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What are the main solvents used in this solution? I am uncertain as to what to write on the hazardous waste disposal tag in terms of percentages. Thanks!
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What is the recommended plating process (procedure, temperature, etc.) for this product (901670)?
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This product is not specifically tested for plating and a specific procedure is not available. However, metal parts to be plated should be thoroughly cleaned before use. The normal cleaning procedures for electroplating are adequate. This solution will show a decrease in pH with use. The pH should not be allowed to deviate from the normal conditions for plating, as inferior deposits result. Adjustment of pH can be conveniently accomplished by the addition of small amounts of ammonium hydroxide to raise pH or citric acid to lower it. The table below offers additional recommended conditions.
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Is it possible to use product 901670 to plate on a surface that is already coated with gold?
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Product 901670 is not suitable for deposition onto gold. It operates via a displacement mechanism and will not displace itself to build thickness on a gold surface.
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Could bright electroless gold (901670) be deposited onto silver formed by electroless silver solution (901669)?
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901670 confirmed it will not deposit onto silver.
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Is electroless gold plating solution suitable on SS 316L components. Also will the plated gold color remains same if the component is heated at 500 deg C.
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To get this to react, the stainless steel would first need to be coated with a metal that the solution can displace, (e.g. copper, commercial brass, Kovar, nickel, tin-lead solders, pure tin, iron, and indium antimonide). The solution cannot plate stainless steel. The most recommended approach would probably be to attempt to plate using the Electroless nickel plating solution, followed by a Bright Electroless gold plating solution. This would not be guaranteed to work, but it would be the most logical route.
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What are optimal temperatures for depositing gold and silver, using the corresponding electroless plating solutions, onto copper? We found that higher temperatures resulted in rapid evaporation in the fume hood.
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The recommended plating temperature of both gold and silver electroless plating solution is 90 °C for most metals. Higher temperature leads to faster evaporation.
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Where can I find the protocol for electroless gold plating on platinum electrodes?
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A specific protocol is not readily available for this product. Please see the link below to a pubication that may be helpful:
https://core.ac.uk/download/pdf/81857506.pdfHelpful?
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Do I need an activation for deposition of gold on aluminum or only a cleaning would be enough?
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Bright electroless gold plating solution can be used in the activation of aluminum alloy. See the link below to review a publication on Aluminun activation for use with this product:
Electroless Gold Plating on Aluminum Patterned Chips for CMOS-Based Sensor Applications:
https://iopscience.iop.org/article/10.1149/1.3244208/metaHelpful?
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