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蒸汽密度
6.9 (vs air)
化驗
98%
形狀
crystals
成份
Degree of hydration, ~1
反應適用性
core: copper
SMILES 字串
O.CC(=O)O[Cu]OC(C)=O
InChI
1S/2C2H4O2.Cu.H2O/c2*1-2(3)4;;/h2*1H3,(H,3,4);;1H2/q;;+2;/p-2
InChI 密鑰
NWFNSTOSIVLCJA-UHFFFAOYSA-L
訊號詞
Warning
危險分類
Acute Tox. 4 Oral - Aquatic Acute 1 - Eye Irrit. 2 - Skin Irrit. 2 - STOT SE 3
標靶器官
Respiratory system
儲存類別代碼
11 - Combustible Solids
水污染物質分類(WGK)
WGK 3
閃點(°F)
Not applicable
閃點(°C)
Not applicable
個人防護裝備
dust mask type N95 (US), Eyeshields, Gloves
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商品
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
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