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654892

Sigma-Aldrich

Aldrich® Negative Photoresist Kit I

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About This Item

Code UNSPSC :
12352300
Nomenclature NACRES :
NA.23

Température de stockage

2-8°C

Niveau de qualité

100

Catégories apparentées

Description générale

Aldrich® Negative Photoresist Kit I consists of materials for photolithography. The photoresist can be spin coated on the glass substrate for the formation of electrode arrays. The kit also provides masking and patterning on the glass surface.

Application

Aldrich® Negative Photoresist Kit I has been used in the fabrication of microelectrodes by photolithography. It can also be used to fabricate the droplet-based microfluidic device, microfluidic chips, glass optical waveguides, and integrated grating couplers.

Informations légales

Aldrich is a registered trademark of Sigma-Aldrich Co. LLC

Composants de kit également disponibles séparément

Réf. du produit
Description
FDS
  • 651761Negative resist remover I 250 mLFDS
  • 651788Negative resist developer I 250 mLFDS
  • 651796Negative photoresist I 100 mLFDS
  • 651974Negative resist thinner I 100 mLFDS

Mention d'avertissement

Danger

Classification des risques

Acute Tox. 4 Dermal - Acute Tox. 4 Inhalation - Acute Tox. 4 Oral - Aquatic Chronic 2 - Asp. Tox. 1 - Carc. 2 - Eye Dam. 1 - Repr. 1B - Skin Corr. 1 - STOT RE 2 Inhalation - STOT SE 3

Organes cibles

Central nervous system,Liver,Kidney, Respiratory system

Code de la classe de stockage

6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects

Point d'éclair (°F)

Not applicable

Point d'éclair (°C)

Not applicable

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Certificats d'analyse (COA)

Lot/Batch Number

Désolés, nous n'avons pas de COA pour ce produit disponible en ligne pour le moment.

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Silicon wafer (single side polished), <100>, N-type, contains no dopant, diam. × thickness 2 in. × 0.5 mm

Sigma-Aldrich

646687

Silicon

Polyisoprene, trans pellets, 99+% trans-1,4

Sigma-Aldrich

182168

Polyisoprene, trans

Fabrication and characterization of optical waveguides and grating couplers
J P Sharpe, et al.
European Journal of Physics, 34, 1317-1317 (2013)
High-speed droplet actuation on single-plate electrode arrays
Banerjee AN, et al.
Journal of Colloid and Interface Science, 362(2), 567-574 (2011)
Arghya Narayan Banerjee et al.
Journal of colloid and interface science, 362(2), 567-574 (2011-08-02)
This paper reports a droplet-based microfluidic device composed of patterned co-planar electrodes in an all-in-a-single-plate arrangement and coated with dielectric layers for electrowetting-on-dielectric (EWOD) actuation of discrete droplets. The co-planar arrangement is preferred over conventional two-plate electrowetting devices because it
A compact 3D-printed interface for coupling open digital microchips with Venturi easy ambient sonic-spray ionization mass spectrometry
Hu J, et al.
Analyst, 140(5), 1495-1501 (2015)
Jie-Bi Hu et al.
The Analyst, 140(5), 1495-1501 (2015-01-28)
Digital microfluidics (DMF) based on the electrowetting-on-dielectric phenomenon is a convenient way of handling microlitre-volume aliquots of solutions prior to analysis. Although it was shown to be compatible with on-line mass spectrometric detection, due to numerous technical obstacles, the implementation
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Protocoles

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

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