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215619

Sigma-Aldrich

Silicon

powder, −325 mesh, 99% trace metals basis

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About This Item

Formule linéaire :
Si
Numéro CAS:
7440-21-3
Poids moléculaire :
28.09
Numéro CE :
231-130-8
Numéro MDL:
MFCD00085311
Code UNSPSC :
12141911
ID de substance PubChem :
24852908
Nomenclature NACRES :
NA.23

Niveau de qualité

100

Pureté

99% trace metals basis

Forme

powder

Taille des particules

−325 mesh

Point d'ébullition

2355 °C (lit.)

Pf

1410 °C (lit.)

Densité

2.33 g/mL at 25 °C (lit.)

Chaîne SMILES 

[Si]

InChI

1S/Si

Clé InChI

XUIMIQQOPSSXEZ-UHFFFAOYSA-N

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Description générale

Silicon powder is a fine, gray powder. This silicon powder has been passed through a 325-mesh screen, meaning that the particles are small enough to pass through a sieve with openings that are approximately 44 thousandths of an inch in diameter. Silicon is a chemical element and is a hard, brittle, metallic-gray solid that is highly resistant to chemical attack and has a high melting point. Silicon is the second most abundant element in the Earth’s crust and is found in a variety of minerals.

Application

Silicon can be used as anode material in lithium-ion batteries.

It can be used to fabricate Al2O3-C refractories. The silicon powder generates β-Sialon whiskers which imparts high-temperature strength, slag resistance and thermal shock resistance of the refractories.

It can be incorporated into high-densitypolyethylene (HDPE) polymer composites. The addition of silicon powder enhancesthermal stability and thermal conductivity of composites.

Pictogrammes

Flame
GHS02

Mention d'avertissement

Warning

Mentions de danger

H228

Classification des risques

Flam. Sol. 2

Code de la classe de stockage

4.1B - Flammable solid hazardous materials

Classe de danger pour l'eau (WGK)

WGK 3

Point d'éclair (°F)

Not applicable

Point d'éclair (°C)

Not applicable

Équipement de protection individuelle

Eyeshields, Gloves, type N95 (US)

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Certificats d'analyse (COA)

Lot/Batch Number
MKCT8391
MKCR9919
MKCP7149
MKCK6629
MKCG5658

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Seungil Park et al.
Journal of nanoscience and nanotechnology, 13(5), 3397-3402 (2013-07-19)
We investigated the thin film growths of hydrogenated silicon by hot-wire chemical vapor deposition with different flow rates of SiH4 and H2 mixture ambient and fabricated thin film solar cells by implementing the intrinsic layers to SiC/Si heterojunction p-i-n structures.
Jaewoo Lee et al.
Journal of nanoscience and nanotechnology, 13(5), 3495-3499 (2013-07-19)
A spin-casting process for fabricating polycrystalline silicon sheets for use as solar cell wafers is proposed, and the parameters that control the sheet thickness are investigated. A numerical study of the fluidity of molten silicon indicates that the formation of
Jae Cheol Shin et al.
Journal of nanoscience and nanotechnology, 13(5), 3511-3514 (2013-07-19)
We have characterized the structural properties of the ternary In(x)Ga(1-x)As nanowires (NWs) grown on silicon (Si) substrates using metalorganic chemical vapor deposition (MOCVD). Au catalyzed vapor-liquid-solid (VLS) mode was used for the NW growth. The density of the In(x)Ga(1-x)As NW
Chengyong Li et al.
Journal of nanoscience and nanotechnology, 13(3), 2272-2275 (2013-06-13)
Mesoporous Si-C-O fibers were fabricated by air activation of a kind of carbon-rich SiC-C fibers at 600 degrees C. The SiC-C fibers were prepared from the hybrid precursor of polycarbosilane and pitch through melt-spinning, air curing and pyrolysis in nitrogen.
Bo-Soon Kim et al.
Journal of nanoscience and nanotechnology, 13(5), 3622-3626 (2013-07-19)
A subwavelength structure (SWS) was formed via a simple chemical wet etching using a gold (Au) catalyst. Single nano-sized Au particles were fabricated by metallic self-aggregation. The deposition and thermal annealing of the thin metallic film were carried out. Thermal
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