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767484

Sigma-Aldrich

Nickel

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

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About This Item

Formule empirique (notation de Hill):
Ni
Numéro CAS:
7440-02-0
Poids moléculaire :
58.69
Numéro CE :
231-111-4
Numéro MDL:
MFCD00011137
Code UNSPSC :
12352103
ID de substance PubChem :
329767317
Nomenclature NACRES :
NA.23

Pureté

99.95% trace metals basis

Forme

solid

Pertinence de la réaction

core: nickel

Résistivité

6.97 μΩ-cm, 20°C

Diam. × épaisseur

2.00 in. × 0.25 in.

Point d'ébullition

2732 °C (lit.)

Pf

1453 °C (lit.)

Densité

8.9 g/mL at 25 °C (lit.)

Chaîne SMILES 

[Ni]

InChI

1S/Ni

Clé InChI

PXHVJJICTQNCMI-UHFFFAOYSA-N

Catégories apparentées

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

Pictogrammes

Health hazardExclamation mark
GHS08,GHS07

Mention d'avertissement

Danger

Mentions de danger

H317,H351,H372

Classification des risques

Carc. 2 - Skin Sens. 1 - STOT RE 1

Code de la classe de stockage

6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

Classe de danger pour l'eau (WGK)

WGK 2

Point d'éclair (°F)

Not applicable

Point d'éclair (°C)

Not applicable

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