767514

Tantal

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

• Synonym(e): Ta
• Empirische Formel (Hill-System): Ta
• CAS-Nummer: 7440-25-7
• Molekulargewicht: 180.95
• EG-Nummer: 231-135-5
• MDL-Nummer: MFCD00011252
• UNSPSC-Code: 12352103
• PubChem Substanz-ID: 329767321
• NACRES: NA.23

Eigenschaften

• Dampfdruck: <0.01 mmHg ( 537.2 °C)
• Assay: 99.95% trace metals basis
• Form: foil
• Selbstzündungstemp.: 572 °F
• Eignung der Reaktion: core: tantalum
• Widerstandsfähigkeit: 13.5 μΩ-cm, 20°C
• Durchm. × Dicke: 2.00 in. × 0.25 in.
• bp: 5425 °C (lit.)
• mp (Schmelzpunkt): 2996 °C (lit.)
• Dichte: 16.69 g/cm³ (lit.)
• SMILES String: [Ta]
• InChI: 1S/Ta
• InChIKey: GUVRBAGPIYLISA-UHFFFAOYSA-N

Beschreibung

Anwendung

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

Sicherheitshinweise

• Lagerklassenschlüssel: 11 - Combustible Solids
• WGK: nwg
• Flammpunkt (°F): Not applicable
• Flammpunkt (°C): Not applicable