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267481

Sigma-Aldrich

Titanium

foil, thickness 0.25 mm, 99.99% trace metals basis

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700 MG
CHF 195.00

CHF 195.00

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700 MG
CHF 195.00

About This Item

Formula empirica (notazione di Hill):
Ti
Numero CAS:
7440-32-6
Peso molecolare:
47.87
Numero CE:
231-142-3
Numero MDL:
MFCD00011264
Codice UNSPSC:
12141746
ID PubChem:
24856227
NACRES:
NA.23

CHF 195.00

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Livello qualitativo

100

Saggio

99.99% trace metals basis

Stato

foil

Temp. autoaccensione

860 °F

Resistività

42.0 μΩ-cm, 20°C

Spessore

0.25 mm

P. ebollizione

3287 °C (lit.)

Punto di fusione

1660 °C (lit.)

Densità

4.5 g/mL at 25 °C (lit.)

applicazioni

battery manufacturing

Stringa SMILE

[Ti]

InChI

1S/Ti
RTAQQCXQSZGOHL-UHFFFAOYSA-N

Categorie correlate

Descrizione generale

Ti has low thermal and electrical conductivity. It is highly corrosion-resistant and has a high strength to weight ratio. A few angstroms thick layer of titania on the surface of Ti products makes its corrosion resistant.5 Ti foils could be employed as a substrate to grow arrays of hematite nanorods by hydrothermal method.[1] A study reports pressure less sintering of SiC pieces and single crystals to Ti foils at 1500oC.[2]Ti foil may be applied as an interlayer, diffusion bonded during the self joining of Si3N4. Si3N4/Ti-foil/Si3N4.[3]

Quantità

700 mg = 25 × 25 mm; 2.8 g = 50 × 50 mm

Codice della classe di stoccaggio

11 - Combustible Solids

Classe di pericolosità dell'acqua (WGK)

nwg

Punto d’infiammabilità (°F)

Not applicable

Punto d’infiammabilità (°C)

Not applicable

Dispositivi di protezione individuale

Eyeshields, Gloves, type N95 (US)

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Certificati d'analisi (COA)

Lot/Batch Number
MKCW3413
MKCT1000
MKCR9985
MKCQ3815
MKCM1141

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Titanium 5-10 mm, ≥99.99% trace metals basis (purity exclusive of Na and K content)

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GF84634645

Titanium

Etilenglicole anhydrous, 99.8%

Sigma-Aldrich

324558

Etilenglicole

Joining of silicon nitride with a titanium foil interlayer
Lemus J and Drew RAL
Materials Science & Engineering. A, Structural Materials : Properties, Microstructure and Processing, 352, 169-178 (2003)
Bonding mechanism between silicon carbide and thin foils of reactive metals
Morozumi S, et al.
J. Mater. Sci., 20(11), 3976-3982 (1985)
Large-Scale Porous Hematite Nanorod Arrays: Direct Growth on Titanium Foil and Reversible Lithium Storage.
Song Y et al.
The Journal of Physical Chemistry C, 114(49), 21158-21164 (2010)
A Kurbad et al.
International journal of computerized dentistry, 16(2), 125-141 (2013-08-13)
This article presents two novel options for lithium-disilicate restorations supported by single-tooth implants. By using a Ti-Base connector, hybrid abutments and hybrid abutment crowns can be fabricated for different implant systems. The latter option in particular is an interesting new
J H Kim et al.
Journal of nanoscience and nanotechnology, 13(7), 4601-4607 (2013-08-02)
Nanocytalline TiN films were deposited on non-alkali glass and Al substrates by reactive DC magnetron sputtering (DCMS) with an electromagnetic field system (EMF). The microstructure and corrosion resistance of the TiN-coated Al substrates were estimated by X-ray diffraction (XRD), scanning
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