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Sigma-Aldrich

Nichrome etchant

standard

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About This Item

MDL number:
MFCD07370976
UNSPSC Code:
12161700
NACRES:
NA.23

grade

standard

composition

volatiles, 85%

color

clear yellow-orange

bp

100 °C/1 atm

density

1.16 g/mL at 25 °C

Related Categories

General description

Nichrome etchant is a high purity etching system that is a mixture of ceric ammonium nitrate and nitric acid. It can be used to etch the nickel and chromium alloy.

Application

Ceric ammonium nitrate-based etchant. Etches Al, Cr, Cu, Ni, GaAs. Surface oxidizes Si, Ta/TaN. Etch rate of 50 Å/sec @ 40 °C. Etches cleanly with only a deionized water rinse needed.
Nichrome etchant is used in the fabrication of microheater patterns of polydimethyl siloxane (PDMS), silica (SiO2) and glass substrates, which can be further used in the fabrication of flow sensors. It may also be used to etch out nickel (Ni) from the electroplated Ni on amorphous silica wafers.
For use at room temperature or elevated temperature. Etches cleanly, eliminating need for an intermediate rinse.

Features and Benefits

Designed for etching nichrome thin films used in microelectronic applications. Compatible with both positive and negative photoresists and provides fine-line control with minimal undercutting. Filtered to 0.2 micron to remove particlulates and composed of semiconductor grade materials.

Signal Word

Danger

Hazard Statements

H272,H290,H314,H317,H411

Hazard Classifications

Aquatic Chronic 2 - Eye Dam. 1 - Met. Corr. 1 - Ox. Liq. 2 - Skin Corr. 1B - Skin Sens. 1

Supplementary Hazards

EUH071

Storage Class Code

5.1B - Oxidizing hazardous materials

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

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Simulation and feasibility study of flow sensor on flexible polymer for healthcare application.
Maji D and Das S
IEEE Transactions on Bio-Medical Engineering, 60(12), 3298-3305 (2013)
Perfectly plastic flow in silica glass.
Kermouche G, et al.
Acta Materialia, 114(12), 146-153 (2016)
Etch rates for micromachining processing-Part II.
Williams KR, et al.
Journal of Microelectromechanical Systems : A Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems, 12(6), 761-778 (2003)

Protocols

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

Negative Photoresist Procedure

Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.

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