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Sigma-Aldrich

Gallium–Indium eutectic

Ga 75.5% / In 24.5%, ≥99.99% trace metals basis

Synonym(s):

EGaIn

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About This Item

MDL number:
MFCD00144387
UNSPSC Code:
11101711
PubChem Substance ID:
24872973
NACRES:
NA.23

assay

≥99.99% trace metals basis

form

liquid

composition

Ga 75.5% / In 24.5%

mp

15.7 °C (lit.)

density

6.25 g/mL at 25 °C (lit.)

SMILES string

[Ga].[In]

InChI

1S/Ga.In

InChI key

SPAHBIMNXMGCMI-UHFFFAOYSA-N

Related Categories

General description

Gallium-indium eutectic 99.99% is a unique liquid metal alloy with a melting point of 15.7°C. It has a self-limiting oxide layer that retains its shape, making it ideal for use in various applications. This material is easy to mold, stretch, and form into a variety of shapes. It is also self-healing, which makes it useful in situations where the material may experience wear and tear. With its exceptional properties, gallium-indium eutectic 99.99% is a valuable material for a range of industries, including electronics, robotics, and medical devices.

Application

In the electronics industry, gallium-indium eutectic 99.99% is used as a thermal interface material due to its high thermal conductivity. It is also used as a flexible conductor in soft robotics and stretchable electronics. Because of its ability to conform to irregular shapes and high electronic conductivity, EGaIn is commonly used as an electrical contact for device testing and as the top contact in molecular electronics applications. Additionally, this liquid metal alloy is utilized in medical devices such as soft implants and wearable health monitors due to its biocompatibility and flexibility. Gallium-indium eutectic 99.99% has a wide range of potential applications, and its unique properties make it a valuable material for many industries.

Features and Benefits

  • Increase Power Performance: Its high thermal conductivity makes it a high-performing thermal interface material for increased power performance in electronics.

  • Simplify Electrical Contact: Its excellent electronic conductivity, conformal shape, and self-healing properties make it easy to make electrical contact for devices and molecular electronics

  • Robust Contact: This material conforms to irregular shapes, making it perfect for use in soft robotics and stretchable electronics as a flexible conductor and robust contact.

signalword

Danger

Hazard Classifications

Acute Tox. 4 Oral - Aquatic Chronic 3 - Met. Corr. 1 - STOT RE 1 Inhalation

target_organs

Lungs

Storage Class

6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

wgk_germany

WGK 3

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Eyeshields, Faceshields, Gloves, type P3 (EN 143) respirator cartridges

Certificates of Analysis (COA)

Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.

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On the use of Ga-In eutectic and halogen light source for testing P3HT-PCBM organic solar cells
Du Pasquier A, et al.
Solar Energy Mat. and Solar Cells, 90(12), 1828-1839 (2006)
Eutectic Gallium-Indium (EGaIn): A Liquid Metal Alloy for the Formation of Stable Structures in Microchannels at Room Temperature
Dickey MD, et al.
Advances in Functional Materials, 18(7), 1097-1104 null
Nonreciprocal microwave devices based on magnetic nanowires.
Kuanr BK, et al.
Applied Physics Letters, 94(20) (2009)
Yu Long Han et al.
Scientific reports, 5, 11488-11488 (2015-07-02)
This paper describes a novel approach to fabricate paper-based electric circuits consisting of a paper matrix embedded with three-dimensional (3D) microchannels and liquid metal. Leveraging the high electric conductivity and good flowability of liquid metal, and metallophobic property of paper
Seoungwoong Park et al.
ACS nano, 14(7), 8485-8494 (2020-06-25)
Transition metal dichalcogenides (TMDs) have attracted significant interest as one of the key materials in future electronics such as logic devices, optoelectrical devices, and wearable electronics. However, a complicated synthesis method and multistep processes for device fabrication pose major hurdles
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