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749044

Sigma-Aldrich

Titanium

sputtering target, diam. × thickness 3.00 in. × 0.125 in., 99.995% trace metals basis

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About This Item

Empirical Formula (Hill Notation):
Ti
CAS Number:
Molecular Weight:
47.87
EC Number:
MDL number:
UNSPSC Code:
12352103
PubChem Substance ID:

assay

99.995% trace metals basis

form

solid

autoignition temp.

860 °F

reaction suitability

core: titanium

resistivity

42.0 μΩ-cm, 20°C

diam. × thickness

3.00 in. × 0.125 in.

bp

3287 °C (lit.)

mp

1660 °C (lit.)

density

4.5 g/mL at 25 °C (lit.)

SMILES string

[Ti]

InChI

1S/Ti

InChI key

RTAQQCXQSZGOHL-UHFFFAOYSA-N

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.

Storage Class

11 - Combustible Solids

wgk_germany

nwg

flash_point_f

Not applicable

flash_point_c

Not applicable


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Dahn, J. R.; Trussler, S.; Hatchard, T. D.; Bonakdarpour, B. et al.
Chemistry of Materials, 14, 3519-3519 (2002)
Hahn, H.; Averback, R. S.
Journal of Applied Physics, 67, 1113-1113 (1990)
Oechsner, H.
Applied Physics. A, Materials Science & Processing, 8, 185-185 (1975)
Sigmund, P.
Physical Review, 184, 383-383 (1969)
A Kurbad et al.
International journal of computerized dentistry, 16(2), 125-141 (2013-08-13)
This article presents two novel options for lithium-disilicate restorations supported by single-tooth implants. By using a Ti-Base connector, hybrid abutments and hybrid abutment crowns can be fabricated for different implant systems. The latter option in particular is an interesting new

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