Unfortunately, stainless steel has not been tested for use with the 901655 Electroless nickel plating solution. This product can work on Si, Ge, GaAs, CdS, Ni, and Kovar. Some NiP formed in a side reaction improves corrosion resistance and solderability. The chemical reaction during the electroless plating process involves hypophosphite ions. Although the P content hasn't been tested, there should be a lot of phosphorus in this product as it is the main component. Instructions for use can be found in the product information sheet: https://www.sigmaaldrich.com/deepweb/assets/sigmaaldrich/product/documents/405/456/901655-product-info-ms.pdf
901655
Electroless nickel plating solution
ammonia free
Synonym(s):
Nickelex
About This Item
Recommended Products
form
liquid
color
blue to green
pH
4.8-5.2
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General description
Advantages
- Stable, ready to use
- Plates without generating ammonia fumes
- Produces quality electrical contacts on p- and n-type silicon
- Does not compensate for p- or n- type conductivity
- Excellent adhesion and solderability
- Plates on silicon, germanium, gallium arsenide, cadmium sulfide
The chemical reaction during the electroless plating process involves an oxidation-reduction reaction between nickelous and hypophosphite ions. The reaction is essentially a two step process occurring simultaneously.
(1) H2PO2- + H2O --> H2OPO3- + H2
(2) Ni ++ (complex) + H2 --> Ni + 2H+
The reaction progresses catalytically with nickel deposition occurring at the operating temperature of 95 °C - 100 °C. The nascent hydrogen evolved insures an oxide free nickel deposit. In addition some NiP formed in a side reaction improves corrosion resistance and solderability. The nickel deposit is highly conductive, remains unstressed, particularly after suitable heat treatment, and shows good adherence.
Application
- Nickelex provides good mechanical and electrical contacts for semicodonductor devices (silicon rectifers, solar cells, varactors, microwave diodes, transistors, microcircuits, etc.). The quality of the electrical contact is excellent if the surface of silicon is abraded by lapping to increase surface recombination velocity; if the surface is highly doped from diffusion; or if the semicondcutor resistivity is low (0.1 ohm-cm). Nickelex also produces adherent deposits on germanium, gallium arsenide, and cadmium sulfide.
- The Nickelex plate exhibits excellent solderability with lead, tin, and Pb/Sn alloys. Flux can be omitted when furnaced soldered in a hydrogen or non-oxidizing atmosphere.
Instructions
Complete metallization procedures are provided for silicon rectifier and planar device fabrication. These procedures should be followed to obtain optimum adhesion of nickel and quality of the ohmic contacts.
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Acute Tox. 3 Dermal - Acute Tox. 3 Oral - Acute Tox. 4 Inhalation - Aquatic Acute 1 - Aquatic Chronic 1 - Carc. 1A Inhalation - Eye Irrit. 2 - Muta. 2 - Repr. 1B - Resp. Sens. 1 - Skin Irrit. 2 - Skin Sens. 1 - STOT RE 1
Target Organs
Lungs
Storage Class Code
6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects
WGK
WGK 3
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
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I want to know if this solution can be used to deposit Ni-P coating on stainless steel. Also, what is the P content in the coating? Does it come with the use instructions? Thank you.
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