647535

Silicon

wafer (single side polished), <100>, N-type, contains no dopant, diam. × thickness 3 in. × 0.5 mm

• Synonym(s): Silicon element
• Linear Formula: Si
• CAS Number: 7440-21-3
• Molecular Weight: 28.09
• NACRES: NA.23
• PubChem Substance ID: 24883543
• UNSPSC Code: 12352300
• EC Number: 231-130-8
• MDL number: MFCD00085311

Properties

• Quality Segment: 100
• form: crystalline (cubic (a = 5.4037)), wafer (single side polished)
• does not contain: dopant
• sustainability: Sustainability features
• diam. × thickness: 3 in. × 0.5 mm
• matrix: silicon base material
• bp: 2355 °C (lit.)
• mp: 1410 °C (lit.)
• density: 2.33 g/mL at 25 °C (lit.)
• semiconductor properties: <100>, N-type
• SMILES string: [Si]
• InChI: 1S/Si
• InChI key: XUIMIQQOPSSXEZ-UHFFFAOYSA-N

Description

General description

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0 vortex defects. Etch pitch density (EPD) <100 cm^-2. Resistivity 1,000- 2,300 Ωcm

Oxygen content: <= 1~1.8 x 10¹⁸ /cm³; Carbon content: <= 5 x 10¹⁶ /cm³; Boule diameter: 1~8 ″

Application

Silicon wafers are majorly used in electronics as substrate materials. They are also used in a variety of applications like solar cells, microelectronics, and other integrated circuits.

Safety Information

• WGK: nwg
• Flash Point (°F): Not applicable
• Flash Point (°C): Not applicable
• PPE (personal protective equipment): Eyeshields, Gloves, type N95 (US)
• Storage Class: 11 - Combustible Solids