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Sigma-Aldrich

Hexadecylphosphonic acid

97%

Synonym(s):

n-Hexadecylphosphonic acid, HDPA

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About This Item

Empirical Formula (Hill Notation):
C16H35O3P
CAS Number:
Molecular Weight:
306.42
MDL number:
UNSPSC Code:
12352300
PubChem Substance ID:
NACRES:
NA.23

Assay

97%

form

solid

mp

88-93 °C

storage temp.

2-8°C

SMILES string

CCCCCCCCCCCCCCCCP(O)(O)=O

InChI

1S/C16H35O3P/c1-2-3-4-5-6-7-8-9-10-11-12-13-14-15-16-20(17,18)19/h2-16H2,1H3,(H2,17,18,19)

InChI key

JDPSFRXPDJVJMV-UHFFFAOYSA-N

General description

Hexadecylphosphonic acid (HDPA) is an alkyl phosphonic acid that forms a self-assembled monolayer (SAM) for the surface modification of the metal oxide nanostructures.

Application

HDPA forms a resist on the metal substrate which may be used for microcontact printing. It may also find usage as a SAM for the development of a dielectric hybrid for surface controlled organic transistors.

Storage Class Code

11 - Combustible Solids

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable


Certificates of Analysis (COA)

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Fabrication of metal nanowires using microcontact printing
Geissler M, et al.
Langmuir, 19(15), 6301-6311 (2003)
Alkyl phosphonate/phosphate coating on magnetite nanoparticles: a comparison with fatty acids
Sahoo Y, et al.
Langmuir, 17(25), 7907-7911 (2001)
Matthew L Edin et al.
Cells, 9(5) (2020-05-06)
A number of oxylipins have been described as endogenous PPAR ligands. The very short biological half-lives of oxylipins suggest roles as autocrine or paracrine signaling molecules. While coronary arterial atherosclerosis is the root of myocardial infarction, aortic atherosclerotic plaque formation
Quantitative Determination and Comparison of the Surface Binding of Phosphonic Acid, Carboxylic Acid, and Catechol Ligands on TiO2 Nanoparticles
Zeininger L, et al.
Chemistry?A European Journal , 22(38), 13506-13512 (2016)
Dielectric surface-controlled low-voltage organic transistors via n-alkyl phosphonic acid self-assembled monolayers on high-k metal oxide
Acton BO, et al.
ACS Applied Materials & Interfaces, 2(2), 511-520 (2010)

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