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化驗
99.7% trace metals basis
形狀
powder
自燃溫度
860 °F
電阻係數
42.0 μΩ-cm, 20°C
粒徑
−100 mesh
bp
3287 °C (lit.)
mp
1660 °C (lit.)
密度
4.5 g/mL at 25 °C (lit.)
SMILES 字串
[Ti]
InChI
1S/Ti
InChI 密鑰
RTAQQCXQSZGOHL-UHFFFAOYSA-N
一般說明
Titanium (Ti) powder with a particle size of 100 mesh is a part of the powder metallurgy based materials. It can be produced by a variety of methods which include plasma rotating electrode process (PREP), gas atomization (GA), plasma atomization (PA) and induction plasma spheroidization (IPS).
應用
Ti powder can be used for applications such as automotive exhaust systems, cookware, tubing, medical implants, building, and construction.
訊號詞
Danger
危險聲明
危險分類
Flam. Sol. 1
儲存類別代碼
4.2 - Pyrophoric and self-heating hazardous materials
水污染物質分類（WGK）
nwg
閃點（°F）
Not applicable
閃點（°C）
Not applicable
個人防護裝備
Eyeshields, Gloves, type N95 (US)
其他客户在看
Conventional titanium powder production, 1-19 (2015)
Titanium Powder Metallurgy, 21-32 (2015)
Titanium Powder Metallurgy, 1-19 (2015)
A Kurbad et al.
International journal of computerized dentistry, 16(2), 125-141 (2013-08-13)
This article presents two novel options for lithium-disilicate restorations supported by single-tooth implants. By using a Ti-Base connector, hybrid abutments and hybrid abutment crowns can be fabricated for different implant systems. The latter option in particular is an interesting new
Jinho Shin et al.
Journal of nanoscience and nanotechnology, 13(8), 5807-5810 (2013-07-26)
In this study, hydroxyapatite (HA) was coated on anodized titanium (Ti) surfaces through radio frequency magnetron sputtering in order to improve biological response of the titanium surface. All the samples were blasted with resorbable blasting media (RBM). RBM-blasted Ti surface
商品
Biomedical implants are essentially foreign substances within the human body that must survive many years’ exposure to demanding mechanical and physiological conditions. Despite these challenges, metal implants have been widely used to substitute for or rebuild hard tissues such as bones and teeth.
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