GF77686521
Polyimide
(PI), film, thickness 0.025 mm, L 5 m, grade kapton hn
Synonym(s):
IM301200
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About This Item
UNSPSC Code:
12352100
NACRES:
NA.23
Recommended Products
form
film
manufacturer/tradename
Goodfellow 776-865-21
L
5 m
thickness
0.025 mm
General description
Polyimides are an important class of high-temperature engineering polymers consist of aromatic dianhydrides and diamine monomers. These polymers are well known for their high-temperature stability, low-temperature tolerance, mechanical strength, chemical resistance, radiation resistance, and excellent dielectric properties.
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Application
Polyimide films (thickness 0.025 mm) can be used in capacitors, flexible printing circuits boards, insulation materials, and also in optoelectronic applications, such as transparent conductive film, transparent substrates for flexible display, and flexible solar cells. It is also used for the fabrication of flexible copper-clad laminates (FCCLs) for advanced microelectronic assembly.
Legal Information
Product of Goodfellow
Storage Class
11 - Combustible Solids
wgk_germany
WGK 3
flash_point_f
Not applicable
flash_point_c
Not applicable
Certificates of Analysis (COA)
Search for Certificates of Analysis (COA) by entering the products Lot/Batch Number. Lot and Batch Numbers can be found on a product’s label following the words ‘Lot’ or ‘Batch’.
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Polyimides
The Biological Effects of Glutamic Acid and Its Derivatives (2012)
A review on colorless and optically transparent polyimide films: Chemistry, process and engineering applications
Ni Hong-jiang, et al.
Journal of Industrial and Engineering Chemistry, 28, 16-27 (2015)
Achievements in low-pressure membrane processes microfiltration (MF) and ultrafiltration (UF) for wastewater and water treatment
Current Topics in Cellular Regulation, 67-107 (2020)
Study on charge transport mechanism and space charge characteristics of polyimide films
Zhou LR, et al.
IEEE Transactions on Dielectrics and Electrical Insulation, 16(4), 1143-1149 (2009)
Preparation and properties of heat-sealable polyimide films with comparable coefficient of thermal expansion and good adhesion to copper matrix.
Zhang XM, et al.
Express Polymer Letters, 11(12) (2017)
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