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Sigma-Aldrich

Copper etchant

Synonym(s):

Copper etching solution

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About This Item

MDL number:
UNSPSC Code:
12352300
NACRES:
NA.23

vapor density

1.3 (vs air)

Application

CE-200 solution can be used to etch out the copper residue or foil from the chemical vapor deposited (CVD) graphene or carbonated films by immersing the substrate with the nanomaterial into the etchant solution for 30 min.
It is ideal for spray etching of copper. Ferric chloride based Cu etchant with etch rate of 0.5 mil/min @ 40 °C.

pictograms

Corrosion

signalword

Danger

hcodes

Hazard Classifications

Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1

Storage Class

8B - Non-combustible corrosive hazardous materials

wgk_germany

WGK 1

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter


Certificates of Analysis (COA)

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The effect of copper pre-cleaning on graphene synthesis
Kim SM, et al.
Nanotechnology, 24(36), 365602-365602 (2013)
Copper etching with cupric chloride and regeneration of waste etchant
Cakir O
Journal of Materials Processing Technology, 175(1-3), 63-68 (2006)
Stretchable and Hydrophobic Electrochromic Devices Using Wrinkled Graphene and PEDOT: PSS
Nemani SK, et al.
Journal of Nanomaterials, 2018(1-3), 63-68 (2018)
Fangyuan Zheng et al.
ACS nano, 14(2), 2137-2144 (2020-01-18)
The emergent two-dimensional (2D) materials are atomically thin and ultraflexible, promising for a variety of miniaturized, high-performance, and flexible devices in applications. On one hand, the ultrahigh flexibility causes problems: the prevalent wrinkles in 2D materials may undermine the ideal
Microbial colonisation of transparent glass-like carbon films triggered by a reversible radiation-induced hydrophobic to hydrophilic transition
Jalvo B, et al.
Royal Society of Chemistry Advances, 6(55), 50278-50287 (2016)

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