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575801

Sigma-Aldrich

Poly(pyromellitic dianhydride-co-4,4′-oxydianiline), amic acid solution

15.0-16.0 wt. % in NMP

Synonym(s):

Pyre-M.L.® RC-5019, Polyamic acid

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About This Item

Linear Formula:
(C12H12N2O .C10H2O6)x
UNSPSC Code:
12162002
NACRES:
NA.23

concentration

15.0-16.0 wt. % in NMP

refractive index

n20/D 1.507

viscosity

50-70 poise

density

1.166 g/mL at 25 °C

storage temp.

−20°C

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Application

  • Synthesis of nano-polyimide for microelectronic applications: This study discusses the synthesis processes from Poly (amic acid) (PAA) of poly (pyromellitic dianhydride-co-4,4′-oxydianiline) and its applications in microelectronics, highlighting its potential in advanced fabrication techniques (Ebnalwaled et al., 2016).

Legal Information

Pyre-M.L. is a registered trademark of Industrial Summit Technologies Corp.

pictograms

Health hazardExclamation mark
GHS08,GHS07

signalword

Danger

Hazard Classifications

Eye Irrit. 2 - Repr. 1B - Skin Irrit. 2 - STOT SE 3

target_organs

Respiratory system

Storage Class

6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects

wgk_germany

WGK 1

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Manuela Loeblein et al.
Small (Weinheim an der Bergstrasse, Germany), 11(48), 6425-6434 (2015-10-21)
Polyimides (PIs) have been praised for their high thermal stability, high modulus of elasticity and tensile strength, ease of fabrication, and moldability. They are currently the standard choice for both substrates for flexible electronics and space shielding, as they render
Nurit Atar et al.
ACS applied materials & interfaces, 7(22), 12047-12056 (2015-05-07)
In low Earth orbit (LEO), hazards such as atomic oxygen (AO) or electrostatic discharge (ESD) degrade polymeric materials, specifically, the extensively used polyimide (PI) Kapton. We prepared PI-based nanocomposite films that show both AO durability and ESD protection by incorporating

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