651834

Nichrome etchant

standard

• Número MDL: MFCD07370976
• Código UNSPSC: 12161700
• NACRES: NA.23

Propiedades

• grado: standard
• Nivel de calidad: 100
• composición: volatiles, 85%
• color: clear yellow-orange
• bp: 100 °C/1 atm
• densidad: 1.16 g/mL at 25 °C

Descripción

Descripción general

Nichrome etchant is a high purity etching system that is a mixture of ceric ammonium nitrate and nitric acid. It can be used to etch the nickel and chromium alloy.

Aplicación

Ceric ammonium nitrate-based etchant. Etches Al, Cr, Cu, Ni, GaAs. Surface oxidizes Si, Ta/TaN. Etch rate of 50 Å/sec @ 40 °C. Etches cleanly with only a deionized water rinse needed.

For use at room temperature or elevated temperature. Etches cleanly, eliminating need for an intermediate rinse.

Nichrome etchant is used in the fabrication of microheater patterns of polydimethyl siloxane (PDMS), silica (SiO₂) and glass substrates, which can be further used in the fabrication of flow sensors. It may also be used to etch out nickel (Ni) from the electroplated Ni on amorphous silica wafers.

Características y beneficios

Designed for etching nichrome thin films used in microelectronic applications. Compatible with both positive and negative photoresists and provides fine-line control with minimal undercutting. Filtered to 0.2 micron to remove particlulates and composed of semiconductor grade materials.

Información de seguridad

• Pictogramas: GHS03,GHS05,GHS07,GHS09
• Palabra de señalización: Danger
• Frases de peligro: H272,H290,H314,H317,H411
• Consejos de prudencia: P210 - P220 - P273 - P280 - P303 + P361 + P353 - P305 + P351 + P338
• Clasificaciones de peligro: Aquatic Chronic 2 - Eye Dam. 1 - Met. Corr. 1 - Ox. Liq. 2 - Skin Corr. 1B - Skin Sens. 1
• Riesgos supl.: EUH071
• Código de clase de almacenamiento: 5.1B - Oxidizing hazardous materials
• Clase de riesgo para el agua (WGK): WGK 3
• Punto de inflamabilidad (°F): Not applicable
• Punto de inflamabilidad (°C): Not applicable