901268

Pure Strip

stabilized sulfuric acid-hydrogen peroxide compound

• Código UNSPSC: 12352200
• NACRES: NA.23

Propiedades

• Formulario: liquid

Descripción

Descripción general

Pure Strip is suitable for stripping both positive and negative photoresists in addition to other organic compounds in a variety of semiconductor, photomask, and IC photolithography compounds. High yields can be achieved due to the high purity/low particulate composition of Pure Strip.
Advantages Pure Strip include negligible attack on exposed metal surfaces, including aluminum, vs. other acidic formulations, residue-free rinsing, and extended bath life (minimum of five days at room temperature). Pure Strip is ready to use and requires no mixing.

Aplicación

Pure Strip may be used at room temperature or at elevated temperature. Higher temperatures will increase the activity but decrease the bath life (1 day at 60-80 °C). Substrates are stripped of photoresist and cleaned effectively with minimal attack on aluminum (approximately 35 Angstroms/minute at room temperature) and negligible attack on other metals and alloys such as titanium, Ti-tungsten, copper, tantalum silicide, and ITO.

Información de seguridad

• Pictogramas: GHS05
• Palabra de señalización: Danger
• Frases de peligro: H290,H314
• Consejos de prudencia: P234 - P280 - P303 + P361 + P353 - P304 + P340 + P310 - P305 + P351 + P338 - P363
• Clasificaciones de peligro: Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A
• Código de clase de almacenamiento: 8B - Non-combustible corrosive hazardous materials
• Clase de riesgo para el agua (WGK): WGK 3
• Punto de inflamabilidad (°F): Not applicable
• Punto de inflamabilidad (°C): Not applicable