667501

Tantalum nitride etchant

• Sinónimos: Tantalum nitride etch
• Número MDL: MFCD08705363
• Código UNSPSC: 12161700
• NACRES: NA.23

Descripción

Descripción general

Tantalum nitride etchant is a high purity etchant systems for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications.

Aplicación

Etchant solution for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications

Características y beneficios

Etch rate 70-80 Å / sec @ 25 C. Use with gold positive or negative photoresist. Rinse with Deionized water.

Nota de preparación

• Etch times vary depending on material type (Ta, TaN, or Ta₂O₅) and purity.
• Dilute with water or lower the temperature to achieve a lower etch rate. Adding 1 part water to 2 parts etchant or reducing the temperature 10 °C will approximately reduce the etch rate by 50%.
• Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation.
• Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.
• Gold would be the ideal etch stop. You might also succeed with tungsten
• Rinse with Deionized water.

Información de seguridad

• Pictogramas: GHS06,GHS05
• Palabra de señalización: Danger
• Frases de peligro: H290,H300 + H310,H314,H331
• Consejos de prudencia: P234 - P261 - P280 - P303 + P361 + P353 - P304 + P340 + P310 - P305 + P351 + P338
• Clasificaciones de peligro: Acute Tox. 1 Dermal - Acute Tox. 2 Oral - Acute Tox. 3 Inhalation - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A
• Riesgos supl.: EUH071
• Código de clase de almacenamiento: 6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
• Clase de riesgo para el agua (WGK): WGK 2
• Punto de inflamabilidad (°F): Not applicable
• Punto de inflamabilidad (°C): Not applicable
• Equipo de protección personal: Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter