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形狀
crystalline (cubic (a = 5.4037))
wafer (single side polished)
品質等級
包含
boron as dopant
直徑× 厚度
2 in. × 0.5 mm
bp
2355 °C (lit.)
mp
1410 °C (lit.)
密度
2.33 g/mL at 25 °C (lit.)
半導體屬性
<100>, P-type
SMILES 字串
[Si]
InChI
1S/Si
InChI 密鑰
XUIMIQQOPSSXEZ-UHFFFAOYSA-N
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應用
包裝
物理性質
儲存類別代碼
13 - Non Combustible Solids
水污染物質分類(WGK)
nwg
閃點(°F)
Not applicable
閃點(°C)
Not applicable
個人防護裝備
Eyeshields, Gloves, type N95 (US)
其他客户在看
商品
Hybrid organic-inorganic sol-gel materials containing silica were first called “ORMOSILs” in 1984.
实验方案
Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.
Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.
Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.
Photoresist kit offers pre-weighed chemical components for lithographic processes, with separate etchants for various substrate choices.
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