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647705

Silicon

wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.3 mm

Sustainability features

Synonym(s):

Silicon element

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About This Item

Linear Formula:
Si
CAS Number:
Molecular Weight:
28.09
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
12352300
MDL number:
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Quality Segment

form

crystalline (cubic (a = 5.4037)), wafer

contains

boron as dopant

greener alternative product characteristics

Design for Energy Efficiency
Learn more about the Principles of Green Chemistry.

sustainability

Sustainability features

diam. × thickness

2 in. × 0.3 mm

bp

2355 °C (lit.)

mp

1410 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

greener alternative category

semiconductor properties

<111>, P-type

SMILES string

[Si]

InChI

1S/Si

InChI key

XUIMIQQOPSSXEZ-UHFFFAOYSA-N

General description

0 vortex defects. Etch pitch density (EPD) < 100 (cm-2). Resistivity 10-3 - 40 Ωcm
Oxygen content: <= 1~1.8 x 1018 /cm3; Carbon content: <= 5 x 1016 /cm3; Boule diameter: 1~8 ″
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1 of 1

This Item
933767GF72027266GF16286227
description

wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.3 mm

description

nanoparticles, 40 nm avg. part. size, ≥99% trace metals basis

description

disks, 13mm, thickness 0.38mm, single crystal, 100%

description

disks, 15.9mm, thickness 0.38mm, single crystal, n-type, 100%

form

wafer, crystalline (cubic (a = 5.4037))

form

nanoparticles, powder or crystals

form

foil

form

foil

Quality Level

100

Quality Level

100

Quality Level

-

Quality Level

-

mp

1410 °C (lit.)

mp

1410 °C (lit.)

mp

1410 °C (lit.)

mp

1410 °C (lit.)

bp

2355 °C (lit.)

bp

2355 °C (lit.)

bp

2355 °C (lit.)

bp

2355 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

density

2.33 g/mL at 25 °C (lit.)

diam. × thickness

2 in. × 0.3 mm

diam. × thickness

-

diam. × thickness

13 mm × 0.38 mm

diam. × thickness

15.9 mm × 0.38 mm


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Storage Class

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