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901823

Sigma-Aldrich

Nickel electroplating solution

Synonym(s):

Ni electroplating solution, Ni plating solution

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About This Item

UNSPSC Code:
12352303
NACRES:
NA.23

form

liquid

contains

1.25 g/L±0.125 g/L stabilizer
0.015 g/L±0.0015 g/L wetting agent
4.25 g/L±0.25 g/L Stress reducer

composition

30 g/L ±0.5 g/L H3BO3
170g/L ±5 g/L Ni(SO3NH2)2.4H2O
9.51 g/L ±1 g/L NiBr2 .xH2O

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General description

Nickel electroplating solution is designed for the fabrication of low stress, smooth and pinhole-free nickel films.

Features and Benefits

  • Deposits have low internal stress and are very ductile.
  • Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity.
  • As plated Ni films have small grains in the range of 10 - 50 nm. Grain size orientations are (111) and (200) for FCC (face centred cubic).
  • Qualified bath metrology for replenishment and a long shelf life.

Electroplated Ni film (5-10 μm thickness) properties:
  • Density: 8.1 g/cm3
  • Young′s modulus: 210 GPa
  • Internal stress 33 ± 13 MPa
  • Tensile strength: 585 ± 40 MPa
  • Grain size: 10-50 nm

Signal Word

Danger

Hazard Classifications

Aquatic Chronic 2 - Carc. 1A Inhalation - Eye Dam. 1 - Muta. 2 - Repr. 1B - Resp. Sens. 1 - Skin Sens. 1 - STOT RE 1 - STOT RE 2 Inhalation

Target Organs

Respiratory Tract

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable


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