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736244

Sigma-Aldrich

Hexadecylphosphonic acid

97%

Synonym(s):

n-Hexadecylphosphonic acid, HDPA

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About This Item

Empirical Formula (Hill Notation):
C16H35O3P
CAS Number:
Molecular Weight:
306.42
MDL number:
UNSPSC Code:
12352300
PubChem Substance ID:
NACRES:
NA.23

Quality Level

Assay

97%

form

solid

mp

88-93 °C

storage temp.

2-8°C

SMILES string

CCCCCCCCCCCCCCCCP(O)(O)=O

InChI

1S/C16H35O3P/c1-2-3-4-5-6-7-8-9-10-11-12-13-14-15-16-20(17,18)19/h2-16H2,1H3,(H2,17,18,19)

InChI key

JDPSFRXPDJVJMV-UHFFFAOYSA-N

General description

Hexadecylphosphonic acid (HDPA) is an alkyl phosphonic acid that forms a self-assembled monolayer (SAM) for the surface modification of the metal oxide nanostructures.

Application

HDPA forms a resist on the metal substrate which may be used for microcontact printing. It may also find usage as a SAM for the development of a dielectric hybrid for surface controlled organic transistors.

Storage Class Code

11 - Combustible Solids

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable


Certificates of Analysis (COA)

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Fabrication of metal nanowires using microcontact printing
Geissler M, et al.
Langmuir, 19(15), 6301-6311 (2003)
Alkyl phosphonate/phosphate coating on magnetite nanoparticles: a comparison with fatty acids
Sahoo Y, et al.
Langmuir, 17(25), 7907-7911 (2001)
Dielectric surface-controlled low-voltage organic transistors via n-alkyl phosphonic acid self-assembled monolayers on high-k metal oxide
Acton BO, et al.
ACS Applied Materials & Interfaces, 2(2), 511-520 (2010)
Rickdeb Sen et al.
Chemistry (Weinheim an der Bergstrasse, Germany), 23(53), 13015-13022 (2017-07-14)
Rapid and quantitative click functionalization of surfaces remains an interesting challenge in surface chemistry. In this regard, inverse electron demand Diels-Alder (IEDDA) reactions represent a promising metal-free candidate. Herein, we reveal quantitative surface functionalization within 15 min. Furthermore, we report the
Characterization of phosphonic acid binding to zinc oxide
Hotchkiss PJ, et al.
Journal of Materials Chemistry, 21(9), 3107-3112 (2011)

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