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667528

Sigma-Aldrich

Copper etchant

Synonym(s):

Copper etching solution

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About This Item

MDL number:
UNSPSC Code:
12352300
NACRES:
NA.23

vapor density

1.3 (vs air)

Quality Level

Application

CE-200 solution can be used to etch out the copper residue or foil from the chemical vapor deposited (CVD) graphene or carbonated films by immersing the substrate with the nanomaterial into the etchant solution for 30 min.
It is ideal for spray etching of copper. Ferric chloride based Cu etchant with etch rate of 0.5 mil/min @ 40 °C.

Pictograms

Corrosion

Signal Word

Danger

Hazard Statements

Hazard Classifications

Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1

Storage Class Code

8B - Non-combustible corrosive hazardous materials

WGK

WGK 1

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

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