추천 제품
vapor density
>1 (vs air)
분석
95%
형태
powder
SMILES string
O[Si](O)(c1ccccc1)c2ccccc2
InChI
1S/C12H12O2Si/c13-15(14,11-7-3-1-4-8-11)12-9-5-2-6-10-12/h1-10,13-14H
InChI key
OLLFKUHHDPMQFR-UHFFFAOYSA-N
유사한 제품을 찾으십니까? 방문 제품 비교 안내
일반 설명
Diphenylsilanediol(DPSD) is an alkoxysilane that is used as a silane based precusor in the synthesis of organosiloxane based resins.
애플리케이션
DPSD may be used as a precursor in the synthesis of linear vinyl oligosiloxane resins which can be potentially used in the fabrication of thermally resistant light emitting diode(LED) encapsulant. Mercaptopropyl-phenyl-oligosiloxane and phenyl-vinyl-oligosiloxane may be synthesized by using DPSD which can further be used as a thiolene derived dielectric layer for organic thin film transistors.
시험 성적서(COA)
제품의 로트/배치 번호를 입력하여 시험 성적서(COA)을 검색하십시오. 로트 및 배치 번호는 제품 라벨에 있는 ‘로트’ 또는 ‘배치’라는 용어 뒤에서 찾을 수 있습니다.
이미 열람한 고객
Mechanism and nanosize products of the sol-gel reaction using diphenylsilanediol and 3-methacryloxypropyltrimethoxysilane as precursors.
The Journal of Physical Chemistry, 109(19), 9397-9403 (2005)
American journal of veterinary research, 42(12), 2178-2181 (1981-12-01)
A controlled clinical trial of the anti-epileptic efficacy and toxic side effects of diphenylsilanediol was conducted on 24 client-owned epileptic dogs. Data obtained from an abbreviated procedural treatment program indicated that diphenylsilanediol compared favorably with primidone as an anti-epileptic compound
The Reactions of Triphenylsilanol and Diphenylsilanediol with Some Titanium Esters.
Journal of the American Chemical Society, 79(1), 4618-4621 (1957)
Sol-gel synthesized linear oligosiloxane-based hybrid material for a thermally-resistant light emitting diode (LED) encapsulant.
Royal Society of Chemistry Advances, 3(23), 8871-8877 (2013)
ACS applied materials & interfaces, 12(50), 56462-56469 (2020-12-02)
Metal nanowires (NWs) are promising transparent conducting electrode (TCE) materials because of their excellent optoelectrical performance, intrinsic mechanical flexibility, and large-scale processability. However, the surface roughness, thermal/chemical instability, and limited electrical conductivity associated with empty spaces between metal NWs are
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