667501
Tantalum nitride etchant
Synonym(s):
Tantalum nitride etch
About This Item
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General description
Application
Features and Benefits
Preparation Note
- Etch times vary depending on material type (Ta, TaN, or Ta2O5) and purity.
- Dilute with water or lower the temperature to achieve a lower etch rate. Adding 1 part water to 2 parts etchant or reducing the temperature 10 °C will approximately reduce the etch rate by 50%.
- Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation.
- Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.
- Gold would be the ideal etch stop. You might also succeed with tungsten
- Rinse with Deionized water.
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Acute Tox. 1 Dermal - Acute Tox. 2 Oral - Acute Tox. 3 Inhalation - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A
Supplementary Hazards
Storage Class Code
6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
WGK
WGK 2
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Personal Protective Equipment
Regulatory Listings
Regulatory Listings are mainly provided for chemical products. Only limited information can be provided here for non-chemical products. No entry means none of the components are listed. It is the user’s obligation to ensure the safe and legal use of the product.
PDSCL
Deleterious substance
Poisonous substance
PRTR
Class I Designated Chemical Substances
ISHL Indicated Name
Substances Subject to be Indicated Names
ISHL Notified Names
Substances Subject to be Notified Names
JAN Code
667501-VAR:
667501-500ML:4548173229775
667501-BULK:
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