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575801

Sigma-Aldrich

Poly(pyromellitic dianhydride-co-4,4′-oxydianiline), amic acid solution

15.0-16.0 wt. % in NMP

Synonym(s):

Pyre-M.L.® RC-5019, Polyamic acid

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250 ML
¥11,700
1 L
¥36,000

¥11,700

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250 ML
¥11,700
1 L
¥36,000

About This Item

Linear Formula:
(C12H12N2O .C10H2O6)x
UNSPSC Code:
12162002
NACRES:
NA.23

¥11,700

In StockDetails

Request a Bulk Order

Quality Level

100

concentration

15.0-16.0 wt. % in NMP

refractive index

n20/D 1.507

viscosity

50-70 poise

density

1.166 g/mL at 25 °C

storage temp.

−20°C

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Application

  • Synthesis of nano-polyimide for microelectronic applications: This study discusses the synthesis processes from Poly (amic acid) (PAA) of poly (pyromellitic dianhydride-co-4,4′-oxydianiline) and its applications in microelectronics, highlighting its potential in advanced fabrication techniques (Ebnalwaled et al., 2016).

Legal Information

Pyre-M.L. is a registered trademark of Industrial Summit Technologies Corp.

Pictograms

Health hazardExclamation mark
GHS08,GHS07

Signal Word

Danger

Hazard Statements

H315,H319,H335,H360D

Hazard Classifications

Eye Irrit. 2 - Repr. 1B - Skin Irrit. 2 - STOT SE 3

Target Organs

Respiratory system

Storage Class Code

6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects

WGK

WGK 1

Regulatory Listings

Regulatory Listings are mainly provided for chemical products. Only limited information can be provided here for non-chemical products. No entry means none of the components are listed. It is the user’s obligation to ensure the safe and legal use of the product.

PRTR

Class I Designated Chemical Substances

FSL

Group 4: Flammable liquids
Type 3 petroleums
Hazardous rank III
Water insoluble liquid

ISHL Indicated Name

Substances Subject to be Indicated Names

ISHL Notified Names

Substances Subject to be Notified Names

JAN Code

575801-VAR:
575801-4L:
575801-1L:4548173995106
575801-250ML:4548173995113
575801-BULK:

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Certificates of Analysis (COA)

Lot/Batch Number
MKCW3429
MKCV5841
MKCW6048
MKCW5996
MKCT3902

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Manuela Loeblein et al.
Small (Weinheim an der Bergstrasse, Germany), 11(48), 6425-6434 (2015-10-21)
Polyimides (PIs) have been praised for their high thermal stability, high modulus of elasticity and tensile strength, ease of fabrication, and moldability. They are currently the standard choice for both substrates for flexible electronics and space shielding, as they render
Nurit Atar et al.
ACS applied materials & interfaces, 7(22), 12047-12056 (2015-05-07)
In low Earth orbit (LEO), hazards such as atomic oxygen (AO) or electrostatic discharge (ESD) degrade polymeric materials, specifically, the extensively used polyimide (PI) Kapton. We prepared PI-based nanocomposite films that show both AO durability and ESD protection by incorporating

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